Work

3D-printed PEEK/BN nanocomposites with enhanced thermal and mechanical performance for advanced chip packaging

Year: 2026

Type: article

Source: Polymer Bulletin

DOI: 10.1007/s00289-026-06643-8

Authors: Vikram Kedambadi Vasu, G. S. Divya, Kusumika Krori Dutta, Sahil, Ankit Kumar Mishra

Institutions: Nitte University, Nitte Meenakshi Institute of Technology, Christ University, Dayananda Sagar College of Engineering, Parul University

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7202368552

FWCI:

Cites: 38

Cited by:

Related to: 10