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Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging

Year: 2026
Type: article
DOI: 10.1002/pola.70283
Authors: Ryan Giang, Ran Tao, Elena Moukhina, Amanda L. Forster, Tae Joon Cho, Polette J. Centellas, Stian K. Romberg, Zois Tsinas, Christopher L. Soles
Institutions: National Institute of Standards and Technology, University of California San Diego, Material Measurement Laboratory, North Carolina State University, Netzsch (Germany), University of Tennessee at Knoxville, Theiss Research
Language: English
Open Access status: closed
Award: PURPOSE: THIS PURPOSE OF THIS PROPOSAL IS TO MAKE FUNDAMENTAL MEASUREMENTS OF CURE KINETICS, CHEMORHEOLOGY AND VISCOELASTIC PROPERTIES, AS WELL AS CURE SHRINKAGE MEASUREMENTS AND MODELING OF REPRESENTATIVE MODEL MATERIALS (RGTMS) TO BETTER CAPTURE THE BEHAVIOR OF THESE ADVANCED SYSTEMS FOR NEXT GENERATION CHIP DESIGNS.ACTIVITIES TO BE PERFORMED: THE RESEARCHERS WILL DESIGN EXPERIMENTS AND MODEL THE PROPERTIES THAT OCCUR DURING CURING TO STUDY THE CURE KINETICS. THE RESEARCHERS WILL DEVELOP NEW METROLOGICAL TOOLS AND METHODS, MATERIAL PROPERTY MODELS, OPEN-SOURCE MATERIALS DATA, AND RESEARCH GRADE TEST MATERIALS (RGTMS).EXPECTED OUTCOMES: THE IMPROVEMENTS WILL HELP PROVIDE A A COMMON MEASUREMENT PLATFORM OF REPRESENTATIVE MODEL MATERIALS FOR THE SEMICONDUCTOR INDUSTRY.INTENDED BENEFICIARIES: RESEARCHERS AND MANUFACTURERS WILL BENEFIT FROM THE ENHANCE PREDICTIVE MODELING AND INFORM ENGINEERING DESIGN PRACTICES IN THE INDUSTRY, THEREBY IMPROVING THE DESIGN, RELIABILITY, AND PERFORMANCE OF NEXT-GENERATION MICROELECTRONICS.SUBRECIPIENT ACTIVITIES: THE RECIPIENT DOES NOT INTEND TO SUBAWARD FUNDS.
OpenAlex ID: W7203583797
FWCI:
Cites: 50
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Related to: 10