A Wafer Microcircuit Defect Extraction Method Based on Weighted Fusion Enhancement and Adaptive Contour Segmentation
Year: 2026
Type: article
Source: Silicon
Authors: Tao Chen, Xianqi Liao, Duo Zou, Jiao Li, Hong Jiang, Chao Bao
Institution: Jingdezhen Ceramic Institute
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7204808065
