P‐166: Impact of Chip‐Scale Package on Image Quality in COB Mini‐LED Displays: Design and Experiment Analysis
Year: 2026
Type: conference-paper
Abstract: Micro‐LEDs are recognized to be with superiority by both industry and academia. However, its practical application has been constrained by manufacturing complexities and cost limitations. In contrast, Mini‐LEDs, while featuring larger dimensions, have achieved significant adoption in backlight units of high‐end displays, direct‐view LED displays, and intelligent lightings. Mini‐LEDs' intrinsic sapphire substrates offer manufacturing flexibility, yet it also act as an undesired waveguide which modifies light distributions and introduces lateral light leakage. This study introduces Chip‐Scale Packaging (CSP) technology, conventionally employed as an encapsulation strategy, to achieve optical modulation in Mini‐LED displays. Through systematic simulation and experimental validation, we demonstrate that the proposed CSP structure achieves 13% viewing angle compression at 60° while maintaining excellent luminous efficiency. The remarkable consistency between simulated and measured results validates CSP as an effective approach for suppressing wide‐angle light leakage in substrate‐retained Mini‐LED architectures, paving the way for their use in advanced display systems requiring precise optical control.
Authors: Weigao Sun, Yide He, Junyang Nie
Language: English
Subfield: Condensed Matter Physics
Field: Physics and Astronomy
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W7212249346