Work

Numerical and experimental investigation of twin-side-cooled heat sink for electronic chips

Year: 2026

Type: article

Source: Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering

DOI: 10.1177/09544089261502680

Authors: Vineet Singh, Niraj Kumar, Vaibhav Trivedi, Vikash Kumar Chauhan, Rishi Nigam, Yogesh Kumar

Institutions: IFTM University, Instituto Federal de Educação, Ciência e Tecnologia do Triângulo Mineiro, Macao University of Tourism, Jaypee Institute of Information Technology, G.L. Bajaj Institute of Technology and Management Greater Noida

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W7225254499

FWCI:

Cites: 31

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Related to: 10