Work

Intrinsic stress analysis of tungsten-lined open TSVs

Year: 2015

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2015.06.014

Authors: Lado Filipovic, Anderson Pires Singulani, Frederic Roger, Sara Carniello, Siegfried Selberherr

Institutions: TU Wien, AMS (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: European Commission, Seventh Framework Programme

Award: G977598292

OpenAlex ID: W798050107

FWCI: 0.839

Cites: 19

Cited by: 13

Related to: 10