Work

Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages

Year: 2010

Type: conference-paper

Source: Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)

Authors: T. Tilford, M. Ferenets, Raphael Adamietz, Sumanth Kumar Pavuluri, James E. Morris, Marc P. Y. Desmulliez, C. Bailey

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W87550179

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