Analysis of Influences on Solar Wafers during Pick-and-Place Operations
Year: 2012
Type: conference-paper
Abstract: Beside the process optimization in solar cell manufacturing within the last years, the automated transport from one process to the following is one major aspect. To stay competitive in this more and more volatile market, the breakage and damage of the wafer and solar cells is essential. Therefore it is absolutely beneficial to know the damage potential of your processes and transport or handling systems. Actual state-of-the-art quality measurement equipments are often insufficient to give a detailed analysis about the influences of the handling influences. Especially the high-speed pick-and-place operations may have influences on the handling object. Therefore new methods for the evaluation of handling influences on the wafer or cell quality is required. With regards to the developments mentioned above, this paper is aimed at the analysis of the forces executed by the gripper on the wafer. Based on these values an indirect evaluation of the handling process can be done.
Authors: Fischmann, C., Giesen, T., Wertz, R., Böttinger, F., Böffert, N., Verl, A.
Institution: Fraunhofer-Gesellschaft
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W99072080