3D Integration-Present and Future
Work
Year: 2008
Type: article
Authors Thomas J. Jiang, Shijian Luo
Institution Micron (United States)
Cites: 8
Cited by: 32
Related to: 10
FWCI: 7.201
Citation percentile (by year/subfield): 94.4
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Industry, innovation and infrastructure
Open Access status: closed