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M. Ragab

Observed names: M Ragab, MohyElDin Ragab
ORCID: 0000-0003-2018-2369
Observed ORCID: 0000-0003-2018-2369
OpenAlex ID: A5001956426
Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
2014 · A.A. El-Daly, A.E. Hammad, et al. · Materials Science and Engineering A · 81
Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn
2014 · A.A. El-Daly, A.E. Hammad, et al. · Journal of Alloys and Compounds · 55
The effect of permanent magnet stirring on the corrosion resistance of Sn-2.0Ag-0.5Cu-2Zn solder alloys in NaCl solution
2023 · M. Ragab, Mahmoud A. Bedair · Materials Chemistry and Physics · 24
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
2020 · A.E. Hammad, M. Ragab · Microelectronics Reliability · 20
Effect of milling energy on the structural evolution and stability of nanostructured Al-5.7wt.% Ni mechanically alloyed eutectic alloy
2012 · MohyElDin Ragab, Hanadi G. Salem · Powder Technology · 16
Optimizing the performance of Sn–Cu alloys via microalloying with Ni and Zn: a study on microstructure, thermal, and mechanical properties
2025 · H. N. Soliman, A. M. El-Taher, et al. · Journal of Materials Science Materials in Electronics · 12
Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field
2019 · A. E. Hammad, M. Ragab · Journal of Materials Science Materials in Electronics · 9
Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring
2019 · A. A. El-Daly, K. M. Zohdy, et al. · Journal of Materials Engineering and Performance · 9
The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy
2024 · M. Ragab, Hind Alsnani, et al. · Journal of Materials Science Materials in Electronics · 7
Ni/Zn additions in Sn–Cu solder: enhanced elasticity and reliability via intermetallic strengthening
2025 · M. Ragab, A. M. El-Taher, et al. · Journal of Materials Science · 6
Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field
2021 · A E Hammad, Sara El-Molla, et al. · Materials Research Express · 6
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Investigating the role of multi-walled carbon nanotubes in microstructural evolution, thermal stability, and mechanical performance of Sn-Ag lead-free solder alloys for advanced electronic applications
2025 · M. Amin, H.N. Soliman, et al. · Materials Today Communications · 5
Microstructural and mechanical enhancements in Sn–Ag–Cu solder alloys via nickel and bismuth additions
2025 · A. M. El-Taher, M. M. Fadel, et al. · Journal of Materials Science Materials in Electronics · 3
Effect of individual and hybrid additions of Al2O3 NP and CNTs on the mechanical strengthening of aluminum-bronze alloy
2020 · E. A. Eid, M. Ragab · SN Applied Sciences · 3
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Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field
2023 · A.E. Hammad, Sara El-Molla, et al. · Microelectronics Reliability · 2
Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy
2022 · A.E. Hammad, Sara El-Molla, et al. · Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications · 1
Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes
2018 · A. E. Hammad, M. Amin, et al. · JOURNAL OF ADVANCES IN PHYSICS
Works count: 17
Citation count: 259
H-index: 8
I10-index: 6
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