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Norbert Herfurth

Observed names: Herfurth, Norbert, N. Herfurth
ORCID: 0009-0006-4295-4031
Observed ORCID: 0009-0006-4295-4031
OpenAlex ID: A5002379934
Assessment of a Chip Backside Protection
2018 · Elham Amini, Anne Beyreuther, et al. · Journal of Hardware and Systems Security · 34
On the Versatility of the IHP BiCMOS Open Source and Manufacturable PDK: A step towards the future where anybody can design and build a chip
2024 · Krzysztof Herman, Norbert Herfurth, et al. · IEEE Solid-State Circuits Magazine · 23
Photon Emission in Silicon Based Integrated Circuits
2019 · Christian Boit, Anne Beyreuther, et al. · ASM International eBooks · 16
IC security and quality improvement by protection of chip backside against hardware attacks
2018 · E. Amini, A. Beyreuther, et al. · Microelectronics Reliability · 11
Special Session: Physical Attacks through the Chip Backside: Threats, Challenges, and Opportunities
2021 · Elham Amini, Kai Bartels, et al. · IEEE VLSI Test Symposium (VTS) · 8
Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform
2024 · K. Anand, P. Steglich, et al. · Thin Solid Films · 6
Prototyping Reconfigurable RRAM-Based AI Accelerators Using the RISC-V Ecosystem and Digital Twins
2023 · Markus Fritscher, Alessandro Veronesi, et al. · Lecture notes in computer science · 6
Second generation of optical IC-backside protection structure
2020 · Elham Amini, Tuba Kiyan, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 6
Contactless device characterization of transistor structures in silicon using electro optical frequency mapping (EOFM)
2020 · A. Beyreuther, N. Herfurth, et al. · Microelectronics Reliability · 4
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
2018 · N. Herfurth, C. Wu, et al. · Microelectronics Reliability · 4
Photon emission as a characterization tool for bipolar parasitics in FinFET technology
2018 · A. Beyreuther, N. Herfurth, et al. · Microelectronics Reliability · 4
PDF
Verified Value Chains, Innovation and Competition
2023 · Arnd Weber, Sylvain Guilley, et al. · IEEE International Conference on Cyber Security and Resilience (CSR) · 3
A scalable & comprehensive resilience concept against optical & physical IC backside attacks
2022 · Norbert Herfurth, Elham Amini, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
EOFM for contactless parameter extraction of low k dielectric MIS structures
2019 · N. Herfurth, E. Amini, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Through the Looking-Glass: Sensitive Data Extraction by Optical Probing of Scan Chains
2024 · Tuba Kiyan, Lars Renkes, et al. · IACR Transactions on Cryptographic Hardware and Embedded Systems · 2
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The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps
2024 · Zhibo Cao, Jens Lehmann, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
Reliable Backside IC Preparation Down to STI Level Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry
2023 · Norbert Herfurth, Awwal A. Adesunkanmi, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2
Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission
2018 · A. Beyreuther, I. Vogt, et al. · Microelectronics Reliability · 2
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials – An adaptive calibration algorithm
2014 · P. Scholz, N. Herfurth, et al. · Microelectronics Reliability · 2
Evaluating an Open-Source Hardware Approach from HDL to GDS for a Security Chip Design - a Review of the Final Stage of Project HEP
2024 · Tim Henkes, Steffen Reith, et al. · Design, Automation, and Test in Europe · 1
Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis
2019 · Elham Amini, Norbert Herfurth, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
EOFM measurements of lateral and vertical Bipolar Transistors in Silicon and SiGe:C Technologies
2019 · A. Beyreuther, N. Herfurth, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition
2018 · N. Herfurth, C. Wu, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
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Micro-contacting of single and periodically arrayed columnar silicon structures by focused ion beam techniques
2014 · F. Friedrich, N. Herfurth, et al. · Applied Physics Letters · 1
Photonic ICs for AI Data Processing: A Primer for Electronic IC Debug and Failure Analysis Engineers
2026 · Chris Boit, Felix Beaudoin, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Works count: 37
Citation count: 146
H-index: 6
I10-index: 4
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