Author

Eric F. Pabo

Observed names: E. Pabo, E.F. Pabo, Eric F Pabo, Eric Pabo

Institution: EV Group (Austria)

Observed institution: EV Group (Austria)

OpenAlex ID: A5003812436

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

2012 · Viorel Dragoi, Eric Pabo, et al. · Microsystem Technologies · 35

Wafer bonding using Cu–Sn intermetallic bonding layers

2013 · C. Flötgen, M. Pawlak, et al. · Microsystem Technologies · 19

Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

2009 · Erkan Cakmak, Viorel Dragoi, et al. · Microsystem Technologies · 12

Cu-Sn transient liquid phase wafer bonding for MEMS applications

2013 · C. Flötgen, M. Pawlak, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10

Wafer bonding with metal layers for MEMS applications

2009 · V. Dragoi, E. Cakmak, et al. · CAS proceedings · 6

Adhesive wafer bonding using photosensitive polymer layers

2009 · Viorel Dragoi, Erkan Cakmak, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Aluminum Thermo Compression Bonding Characterization

2009 · Erkan Cakmak, Viorel Dragoi, et al. · MRS Proceedings · 6

Direct Wafer Bonding Methods: A Practical Process Selection Guide

2020 · Viorel Dragoi, Bernhard Rebhan, et al. · ECS Transactions · 4

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Wafer Bonding for MEMS Vacuum Packaging

2014 · Viorel Dragoi, Eric Pabo · ECS Transactions · 4

Key enabling processes for more-than-moore technologies

2012 · P. Lindner, T. Glinsner, et al. · IEEE International SOI Conference (SOI) · 4

Wafer Bonding Process Selection

2010 · Viorel Dragoi, Eric Pabo · ECS Transactions · 4

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Metal wafer bonding for 3D interconnects and advanced packaging

2012 · V. Dragoi, E. Pabo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Metal Wafer Bonding for MEMS Applications

2008 · Viorel Dragoi, Gerald Mittendorfer, et al. · MRS Proceedings · 3

Wafer bonding technology for new generation vacuum MEMS: challenges and promises

2015 · V. Dragoi, E. Pabo · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration

2012 · Thorsten Matthias, Eric Pabo, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

Advances in spray coating technologies for MEMS, 3DICs and additional applications

2011 · Eric F Pabo, Hirokazu Kurotaki, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Enabling Wafer Level Processes for CIS Manufacturing

2010 · Eric F. Pabo, Garrett Oakes, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging

2008 · Sid Sridharan, Jim Henry, et al. · MRS Proceedings · 2

Wafer bonding for vacuum encapsulated MEMS

2013 · V. Dragoi, M. Pawlak, et al. · CAS proceedings · 1

Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D Integration

2012 · Eric F. Pabo, Viorel Dragoi, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1

Wafer bonding for MEMS and CMOS integration

2011 · V. Dragoi, E. Pabo, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1

Processes for the Integration of MEMS and CMOS

2010 · E.F. Pabo, T. Matthias, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1

Wafer Bonding Process Selection

2010 · Viorel Dragoi, Eric Pabo · ECS Meeting Abstracts · 1

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Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging

2008 · John Maloney, Srinivasan Sridharan, et al. · ECS Meeting Abstracts · 1

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Lithography and Wafer Bonding Solutions for 3D Integration

2026 · Thorsten Matthias, Bioh Kim, et al. · IMAPSource Proceedings

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Works count: 33

Citation count: 132

H-index: 6

I10-index: 4