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Simon Maus
Observed names:
Maus, Simon,
S. Maus
OpenAlex ID:
A5004256761
Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
2009
·
U. Hansen
, S. Maus
, et al.
·
Procedia Chemistry
·
11
Anodic bonding at low voltage using microstructured borosilicate glass thin-films
2010
·
Juergen Leib
, Ulli Hansen
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
8
Characterization of anodic bondable LTCC for wafer-level packaging
2016
·
Xiaodong Hu
, Manuel Bauscher
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
Wafer-level glass-caps for advanced optical applications
2011
·
Juergen Leib
, Oliver Gyenge
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
2016
·
Xiaodong Hu
, Maozhou Meng
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Low temperature glass-thin-films for use in power applications
2011
·
Juergen Leib
, Oliver Gyenge
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology
2009
·
Juergen Leib
, Oliver Gyenge
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
2013
·
Ulli Hansen
, Simon Maus
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
2009
·
S. Maus
, U. Hansen
, et al.
·
Procedia Chemistry
·
2
Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS
2018
·
Xiaodong Hu
, Piotr Mackowiak
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
2017
·
Xiaodong Hu
, P. Mackowiak
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
(Invited) MEMS Capping By Anodic Bonding of Evaporated Glass Thin Films
2016
·
Ulli Hansen
, Simon Maus
, et al.
·
ECS Meeting Abstracts
·
1
Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
2010
·
Ulli Hansen
, Simon Maus
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
1
Wafer-Level Glass Capping as Drop-in for Miniaturized, Advanced Optical COB Packaging
2007
·
Volker Seidemann
, Oliver Gyenge
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Array Packaging with Integrated Mirrors for High Power Multi-Chip UVC-LED Modules
2024
·
Ulli Hansen
, Xiaodong Hu
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
Hermetic SMD-type reflector cavity packaging for DUV LEDs
2020
·
Ulli Hansen
, Simon Maus
, et al.
·
Light-Emitting Devices, Materials, and Applications
Hermetic BSG thin film coatings for harsh environment applications
2010
·
Simon Maus
, Ulli Hansen
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Wafer-level glass capping with optical integration
2010
·
Ulli Hansen
, Simon Maus
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
2009
·
Ulli Hansen
, J. Leib
, et al.
·
Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)
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Works count:
20
Citation count:
51
H-index:
4
I10-index:
1
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