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Author

Frank Frederick

Observed name: F. Frederick
Observed institution: Motorola (United States)
OpenAlex ID: A5004297758
The testability features of the MCF5407 containing the 4th generation ColdFire(R) microprocessor core
2002 · T.L. McLaurin, F. Frederick · IEEE International Test Conference (ITC) · 34
A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process
2020 · S. Sinha, S Hung, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 16
The DFT challenges and solutions for the ARM® Cortex™-A15 Microprocessor
2012 · Teresa McLaurin, Frank Frederick, et al. · IEEE International Test Conference (ITC) · 14
The testability features of the ARM1026EJ microprocessor core
2004 · T.L. McLaurin, F. Frederick, et al. · IEEE International Test Conference (ITC) · 11
3D-Split SRAM: Enabling Generational Gains in Advanced CMOS
2021 · R. Mathur, M. Bhargava, et al. · Custom Integrated Circuits Conference · 5
Design for test features of the ARM clock control macro
2007 · Frank Frederick, Teresa McLaurin · IEEE International Test Conference (ITC) · 4
Applying IEEE Std 1838 to the 3DIC Design Trishul – A Case Study
2021 · Teresa McLaurin, Frank Frederick, et al. · IEEE European Test Symposium (ETS) · 3
A methodology for testing one-hot transmission gate multiplexers
2006 · T.L. McLaurin, F. Frederick, et al. · IEEE International Test Conference (ITC) · 3
Early Design/Technology Exploration of BEOL Options for Hybrid Wafer Bonded Split-SRAM
2022 · Rahul Mathur, Mudit Bhargava, et al. · IEEE Transactions on Electron Devices · 1
Works count: 10
Citation count: 91
H-index: 5
I10-index: 4
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