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Sheng-Chi Hsieh
Observed name:
Sheng -Chi Hsieh
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institutions:
National Chung Cheng University,
Advanced Semiconductor Engineering (Taiwan)
OpenAlex ID:
A5004665933
A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar Applications
2018
·
Cheng-Yu Ho
, Sheng-Chi Hsieh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
32
Glass Based 3D-IPD Integrated RF ASIC in WLCSP
2017
·
Teck Chong Lee
, Yung-Shun Chang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
26
Design and Fabrication of Band-Pass Filter on Glass IPD for 5G New Radio
2020
·
Pao-Nan Lee
, Yu-Chang Hsieh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
19
A V-Band Three-State Phase Shifter in CMOS-MEMS Technology
2013
·
Chia-Chan Chang
, Ying-Chiuan Chen
, et al.
·
IEEE Microwave and Wireless Components Letters
·
18
A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications
2019
·
Cheng-Yu Ho
, Sheng-Chi Hsieh
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
17
mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications
2020
·
Sheng-Chi Hsieh
, Fu-Cheng Chu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
16
mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application
2019
·
Sheng-Chi Hsieh
, Fu-Chen. Chu
, et al.
·
European Microelectronics and Packaging Conference
·
13
Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applications
2018
·
Cheng-Yu Ho
, Chen-Chao Wang
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
7
Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)
2022
·
Cheng-Yu Ho
, Sheng -Chi Hsieh
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
A 2x2 Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems
2022
·
Wen-Chun Hsiao
, Hong-Sheng Huang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
6
Design of millimeter-wave MEMS-based reconfigurable front-end circuits using the standard CMOS technology
2011
·
Chia-Chan Chang
, Sheng-Chi Hsieh
, et al.
·
Journal of Micromechanics and Microengineering
·
6
A Compact mmWave 1x4 Antenna Array Design with Shorted Parasitic Elements for 5G AiP Applications
2024
·
Sheng-Chi Hsieh
, Hong-Sheng Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
A Low-Cost Antenna-in-Package (AiP) for D-Band Application
2023
·
Hung-Chun Kuo
, Po-I Wu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
Corner Analysis of Manufacturing Tolerances of 5G mmWave Antenna in Package/Module (AiP/ AiM)
2021
·
Chia-Ching Chu
, Cheng-Yu Ho
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Analysis and Optimization of a Multilayer Organic Substrate for mmWave Antenna in Package/Module Application
2021
·
Hong-Sheng Huang
, Cheng-Yu Ho
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
4
High-Q 3D-IPD Diplexer with High Aspect Ratio Cu Pillar Inductor
2018
·
Sheng-Chi Hsieh
, Cheng-Yuan Kung
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
4
Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last
2018
·
Chih-Yi Huang
, Tsun-Lung Hsieh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Millimeter-wave antenna in package on low-cost organic substrate for flip chip chip scale (FCCSP) package
2017
·
Cheng-Yu Ho
, Sheng-Chi Hsieh
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
4
Next Generation High-Q Compact Size IPD Diplexer for RF Frond End SiP
2017
·
Sheng-Chi Hsieh
, Pao-Nan Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Frequency-tunable CMOS-MEMS slot antenna
2012
·
Chun-Chi Lin
, Sheng-Chi Hsieh
, et al.
·
Digest - IEEE Antennas and Propagation Society. International Symposium
·
4
Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology
2023
·
Yu-Chang Hsieh
, Wen-Chun Hsiao
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
3
Design of Dual-Band (28/39GHz) Antenna-in-Package with broad bandwidth for 5G Millimeter-Wave Application
2022
·
Sheng-Chi Hsieh
, Hong-Sheng Huang
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System
2020
·
Sheng-Chi Hsieh
, Cheng-Yu Ho
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
3
Design of millimeter-wave reconfigurable bandstop filter using CMOS-MEMS technology
2011
·
Sheng-Chi Hsieh
, Chien-Hsun Chen
, et al.
·
European Microwave Conference (EuMC)
·
3
Design of 40-GHz CRLH-TL chip antenna using 0.35-µm CMOS-MEMS technology
2010
·
Chun-Chi Lin
, Chia-Chan Chang
, et al.
·
IEEE Radio and Wireless Symposium (RWS)
·
3
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Works count:
50
Citation count:
243
H-index:
7
I10-index:
7
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