Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Fabian Michalik
Observed names:
F. Michalik,
Michalik Fabian,
Michalik, F.,
Michalik, Fabian
Institution:
Atotech (Germany)
Observed institutions:
Centre National de la Recherche Scientifique,
École Polytechnique,
Atotech (Germany),
Technische Universität Berlin
OpenAlex ID:
A5004761657
Formation of Carboxy- and Amide-Terminated Alkyl Monolayers on Silicon(111) Investigated by ATR-FTIR, XPS, and X-ray Scattering: Construction of Photoswitchable Surfaces
2013
·
Karola Rück-Braun
, Michael Åxman Petersen
, et al.
·
Langmuir
·
65
An anchoring strategy for photoswitchable biosensor technology: azobenzene-modified SAMs on Si(111)
2008
·
P. Dietrich
, F. Michalik
, et al.
·
Applied Physics A
·
41
Preparation of an Indolylfulgimide‐Adamantane Linker Conjugate with Nitrile Anchoring Groups through Palladium‐Catalyzed Transformations
2009
·
Sebastian Zarwell
, Steffen Dietrich
, et al.
·
European Journal of Organic Chemistry
·
22
Quantitative IR Readout of Fulgimide Monolayer Switching on Si(111) Surfaces
2012
·
Catherine Henry de Villeneuve
, Fabian Michalik
, et al.
·
Advanced Materials
·
13
Fulgimides
2012
·
Karola Rück-Braun
, Kerstin Mayer
, et al.
·
CRC Press eBooks
·
5
Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass
2017
·
Michael Merschky
, Fabian Michalik
, et al.
·
IMAPSource Proceedings
·
4
EcoFlash™: Next level of enhanced isotropic etchants
2015
·
F. Michalik
, N. Luetzow
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Pioneering the Leading-Edge Adhesion Enhancement System for the Future of Package Substrates Bonding
2024
·
Thomas Thomas
, Christopher A. Seidemann
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
Next generation of adhesion enhancement system for high speed substrate manufacturing
2021
·
Thomas Thomas
, Patrick Brooks
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Non-etching adhesion promoter for dry film for semi-additive manufacturing — Advanced dry film pre-treatment
2013
·
D. Tews
, F. Michalik
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
Advanced adhesion enhancement system for high frequency PCB manufacturing
2020
·
Thomas Thomas
, Neal Wood
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
A next generation non etching adhesion promoter enabling streamlined process for Advanced IC substrates
2025
·
Valentina Belova-Magri
, Thomas Thomas
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
The development of a new oxide replacement process to meet the high process cleanliness requirements of mSAP Production
2020
·
Barbara Geibel
, Felix Tang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
mSAP生産の高プロセス清浄度要求に合致する新しい酸化物置換プロセスの開発【JST・京大機械翻訳】
2020
·
Geibel Barbara
, Tang Felix
, et al.
·
IEEE Conference Proceedings
Photochromes: Quantitative IR Readout of Fulgimide Monolayer Switching on Si(111) Surfaces (Adv. Mater. 3/2013)
2013
·
Catherine Henry de Villeneuve
, Fabian Michalik
, et al.
·
Advanced Materials
ChemInform Abstract: Fulgimides
2012
·
Karola Rueck‐Braun
, Kerstin Mayer
, et al.
·
ChemInform
CCDC 711671: Experimental Crystal Structure Determination
2009
·
Zarwell, S.
, Dietrich, S.
, et al.
·
The Cambridge Structural Database
Show more works
View as search
Works count:
18
Citation count:
160
H-index:
5
I10-index:
4
Year
Topic
Type
