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M. Roellig

Detection of buried reference structures by use of atomic force acoustic microscopy
2011 · Andre Striegler, Bernd Koehler, et al. · Ultramicroscopy · 52
The effect of downscaling the dimensions of solder interconnects on their creep properties
2008 · S. Wiese, M. Roellig, et al. · Microelectronics Reliability · 50
Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints
2007 · M. Mueller, S. Wiese, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 46
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
2006 · Mike Roellig, Rainer Dudek, et al. · Microelectronics Reliability · 36
3D integrated LTCC module using μBGA technology for compact C-band RF front-end module
2003 · S. Pinel, S. Chakraborty, et al. · IEEE MTT-S International Microwave Symposium digest · 35
Application of machine learning algorithms in prognostics and health monitoring of electronic systems: A review
2023 · Darshankumar Bhat, Stefan Muench, et al. · e-Prime - Advances in Electrical Engineering Electronics and Energy · 30
Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations
2014 · A. Kabakchiev, B. Metais, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 22
Thermal test- and field cycling induced degradation and its FE-based prediction for different SAC solders
2008 · Rainer Dudek, Wolfgang Faust, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 22
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
2006 · S. Wiese, M. Roellig, et al. · Electronic System-Integration Technology Conference (ESTC) · 21
Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data
2022 · S. Muench, D. Bhat, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 18
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Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
2014 · Karsten Meier, Mike Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 18
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders
2007 · Maik Mueller, Steffen Wiese, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 18
Creep of thermally aged SnAgCu-solder joints
2005 · S. Wiese, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 18
Creep of eutectic SnAgCu in thermally treated solder joints
2005 · S. Wiese, M. Roellig, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions
2007 · Rainer Dudek, Wolfgang Faust, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 16
Characterization of ceramics based on laser speckle photometry
2020 · Lili Chen, Ulana Cikalova, et al. · Journal of sensors and sensor systems · 15
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Life time prediction for lead-free solder joints under vibration loads
2011 · Karsten Meier, Mike Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 15
Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading
2019 · K. Meier, D. Leslie, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 14
Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
2014 · R. Metasch, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 14
Reliability analysis of encapsulated components in 3D-circuit board integration
2018 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Creep Measurements of 200 μm - 400 μm Solder Joints
2007 · Mike Rollig, Steffen Wiese, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Numerical and Experimental Study of the Spatial Stress Distribution on the Cornea Surface During a Non-Contact Tonometry Examination
2018 · S. Muench, M. Roellig, et al. · Experimental Mechanics · 12
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
2018 · F. Kraemer, M. Roellig, et al. · Microelectronics Reliability · 12
Reliability assessment of discrete passive components embedded into PCB core
2014 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12
Characterization methods for determination of temperature depended electrical, thermal, mechanical and fatigue properties of SnAg3.5 solder
2010 · Mike Roellig, Rene Metasch, et al. · Electronic System-Integration Technology Conference (ESTC) · 12
Works count: 108
Citation count: 891
H-index: 15
I10-index: 30
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