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Author

Khiem Ly

Institution: NXP (United States)
Observed institutions: NXP (Germany), NXP (United States)
OpenAlex ID: A5006845496
Energy-Filtered Transmission Electron Microscopy (EFTEM) of Semiconductor Devices
2011 · Sam Subramanian, Gary Clark, et al. · EDFA Technical Articles · 5
Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope
2017 · Kris Dickson, Kent Erington, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Localization of Subtle Front-End FinFET Defects Using EBIC
2024 · Nick Pronin, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2
Transmission Electron Microscopy (TEM) Techniques for Semiconductor Failure Analysis
2022 · Sam Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2
Applications of Electron Energy Loss Near-Edge Structure Analysis for Defect Characterization in Advanced Semiconductor Devices
2025 · Eric Yi, Jacob Levenson, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 1
Failure Analysis of Nickel Silicide Piping Failures: A Case Study
2012 · Clifford Howard, Yuk Tsang, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 1
Advanced Defect Characterization by STEM Analysis
2008 · Sam Subramanian, Raghaw Rai, et al. · EDFA Technical Articles · 1
Advanced FIB/SEM Sample Preparation and Analysis Techniques (2026 Update)
2026 · Sam Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Advanced FIB/SEM Sample Preparation and Analysis Techniques (2025 Update)
2025 · Sam Subramanian, Eric Yi, et al. · Proceedings - International Symposium for Testing and Failure Analysis
The Impact of Varying TEM Accelerating Voltage on Elemental Analysis of Semiconductor Defects
2024 · Jacob Levenson, Swaminathan Subramanian, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Advanced FIB/SEM Sample Preparation and Analysis Techniques (2024 Update)
2024 · Sam Subramanian, Eric Yi, et al. · Proceedings - International Symposium for Testing and Failure Analysis
TEM Techniques for Semiconductor Failure Analysis
2023 · Sam Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Advanced FIB/SEM Sample Preparation and Analysis Techniques
2023 · Sam Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Techniques for Preparation of Damage-Free Ultrathin Cross-Section TEM Samples from Planar TEM Samples
2023 · Jacob Levenson, Swaminathan Subramanian, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Multilayer pFIB Trenches for Multiple Tip EBAC/EBIRCH Analysis and Internal Node Transistor Characterization
2023 · Nick Pronin, Stefano Larentis, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Nanoprobing of Advanced Silicon-On-Insulator Transistors
2019 · Stefano Larentis, Kent Erington, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Cross-Section Sample Preparation Method for Imaging Dopant Related Anomalies Using Scanning Probe Microscopy Techniques
2014 · Swaminathan Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Comparison of Off-Axis Electron Holography and Junction Staining of TEM Sections for Dopant Anomaly Visualization
2013 · Sam Subramanian, Khiem Ly, et al. · EDFA Technical Articles
Energy-Filtered Imaging of Polysilicon Defects, Gate Dielectric and Silicon Nanocrystals Using Plasmon Energy-Loss Electrons
2012 · Swaminathan Subramanian, Khiem Ly, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Flash Single Bit Cycling Fail Due to Charge Accumulation from Incorrect Lateral Drain Junction Formation
2011 · Keith Harber, Sam Subramanian, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Works count: 20
Citation count: 15
H-index: 2
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