Author

Gretchen M. Adema

Observed names: ADEMA, GRETCHEN M., G. Adema, G. M. Adema, G.M. Adema, Gretchen Adema

Observed institutions: MCNC Research and Development Institute, International Rectifier (United Kingdom)

OpenAlex ID: A5006849721

Rapid thermal curing of BCB dielectric

1993 · P.E. Garrou, R.H. Heistand, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 68

Polymer dielectric options for thin film packaging applications

2003 · T.G. Tessier, G.M. Adema, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 32

Passivation schemes for copper/polymer thin-film interconnections used in multichip modules

1993 · G.M. Adema, L.-T. Hwang, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 22

Passivation schemes for copper/polymer thin film interconnections used in multichip modules

2003 · G.M. Adema, L.-T. Hwang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18

Effects of polymer/metal interaction in thin-film multichip module applications

2002 · G.M. Adema, I. Turlik, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18

Benzocyclobutene as a dielectric for multichip module fabrication

2002 · M.J. Berry, T.G. Tessier, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16

Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

2005 · G.M. Adema, C.J. Berry, et al. · International Conference on Multichip Modules (ICMCM) · 14

Prototype optically interconnected multichip module based on computer-generated hologram technology

1993 · James E. Morris, Michael R. Feldman, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11

Flip Chip Production Experience: Some Design, Process, Reliability and Cost Considerations

1996 · J.D. Mis, G.A. Rinne, et al. · SPIE eBooks · 10

Rapid thermal curing of BCB dielectric

2003 · P.E. Garrou, R.H. Heistand, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Effects of polymer/metal interaction in thin-film multichip module applications

1990 · G.M. Adema, I. Turlick, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 9

Holographic optical interconnects for VLSI multichip modules

1994 · M.R. Feldman, J.E. Morris, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 7

Flip chip process development techniques using a modified laboratory aligner bonder

2002 · N. Koopman, G. Adema, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 6

NiV Stress Control Utilizing PVD with an Ar / N2 Gas Mixture

2012 · G. Seryogin, S. Golovato, et al. · IMAPSource Proceedings · 5

Holographic optical interconnects for VLSI multichip modules

2003 · M.R. Feldman, I. Turlik, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5

Development of Seamless High Off-Chip Connectivity

1997 · M. Dibbs, P Garrou, et al. · SPIE eBooks · 5

Chip Scale Packaging with High Reliability for Mcm Applications

1996 · Mark J. Loboda, R.C. Camilletti, et al. · Multichip Modules · 5

The Role Of Surface Modification On Adhesion At The Metal/Polymer Interface

1991 · M. J. Berry, I. Turlik, et al. · MRS Proceedings · 1

Design and process impact on thin-film interconnection performance

1991 · Glenn A. Rinne, Lih-Tyng Hwang, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Sheet Resistance Studies of Reactively Evaporated Ti in Nitrogen and Argon for Silicide Formation

1991 · Henry Berger, Gretchen Adema · Journal of The Electrochemical Society

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Works count: 22

Citation count: 261

H-index: 9

I10-index: 9