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Author

Wei-Lan Chiu

Observed name: W. L. Chiu
ORCID: 0000-0002-7718-8828
Observed ORCID: 0000-0002-7718-8828
OpenAlex ID: A5007168882
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces
2022 · Jia-Juen Ong, Wei-Lan Chiu, et al. · Materials · 91
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Grain growth in electroplated (111)-oriented nanotwinned Cu
2014 · Yi-Sa Huang, Chien-Min Liu, et al. · Scripta Materialia · 67
Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization
2014 · Wei-Lan Chiu, Chien-Min Liu, et al. · Applied Physics Letters · 58
Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification
2023 · Min-Hsun Yu, Jia-Juen Ong, et al. · Applied Surface Science · 47
Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper
2021 · Wei-Lan Chiu, Ou-Hsiang Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 42
Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper
2022 · Wei-Lan Chiu, Ou-Hsiang Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures
2024 · Huai-En Lin, Dinh-Phuc Tran, et al. · Applied Surface Science · 34
Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding
2024 · Huai-En Lin, Dinh-Phuc Tran, et al. · Applied Surface Science · 33
Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding
2023 · Wei-Lan Chiu, Ou-Hsiang Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Nanotwinned Copper Hybrid Bonding and Wafer-On-Wafer Integration
2020 · Wei-Lan Chiu, Kai-Wei Chou, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias
2023 · Shih-Chi Yang, Dinh-Phuc Tran, et al. · Journal of Electroanalytical Chemistry · 26
Formation of plate-like channels in Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
2015 · Wei-Lan Chiu, Chien-Min Liu, et al. · Materials Letters · 25
Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
2024 · Rou-Jun Lee, Pin-Syuan He, et al. · Applied Surface Science · 21
Revealing challenges of downscaling effects on Cu thermal expansion in advanced hybrid bonding using in-situ AFM
2025 · Huai-En Lin, Wei-Lan Chiu, et al. · Applied Surface Science · 20
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
2023 · Wei-You Hsu, Shih-Chi Yang, et al. · Nanomaterials · 18
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Low-Temperature Cu-Cu Bonding Using <111>-oriented and Nanocrystalline Hybrid Surface Grains
2024 · Chen-Ning Li, Jia-Juen Ong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17
A hybrid bonding interconnection with a novel low-temperature bonding polymer system
2022 · Yu-Min Lin, Po-Chih Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 17
In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density
2025 · Hua-Jing Huang, Chien-Hua Wang, et al. · ACS Nano · 16
Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)
2022 · Chia-Hsin Lee, Baron Huang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 16
Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response
2023 · Wei-Lan Chiu, Ching-I Huang · Polymers · 15
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Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process
2024 · Ou-Hsiang Lee, Wei-Lan Chiu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding
2023 · Chia-Hsin Lee, Chung-An Tan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 13
Surface modification on hydrophilicity enhancement using NH4OH, NaOH, and KOH on fine-pitch low-temperature Cu/SiO2 Hybrid Bonding
2023 · Jia-Juen Ong, Dinh-Phuc Tran, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding
2023 · Jia-Juen Ong, Dinh-Phuc Tran, et al. · Surfaces and Interfaces · 11
In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration
2025 · Huai-En Lin, Wei-Lan Chiu, et al. · Journal of Materials Research and Technology · 10
Works count: 60
Citation count: 799
H-index: 17
I10-index: 25
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