Author

Boyd Rogers

Observed name: B. Rogers

Observed institution: Amkor Technology (United States)

OpenAlex ID: A5007633766

Adaptive Patterning Design Methodologies

2016 · Craig Bishop, Boyd Rogers, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 37

Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

2008 · Tong Yan Tee, Bin Tan Long, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 37

Improving WLCSP Reliability Through Solder Joint Geometry Optimization

2013 · Boyd Rogers, Chris Scanlan · IMAPSource Proceedings · 24

Design for board trace reliability of WLCSP under drop test

2009 · Tong Yan Tee, Hun Shen Ng, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 21

Advanced analysis on board trace reliability of WLCSP under drop impact

2010 · Ahmer Syed, Tong Yan Tee, et al. · Microelectronics Reliability · 20

Integrated Testing, Modeling and Failure Analysis of CSPnl for Enhanced Board Level Reliability

2008 · Rex Anderson, Tong Yan Tee, et al. · Wafer-Level Packaging Symposium · 9

Advances in WLCSP Technologies to Enable Cost-Reduction

2010 · Rex Anderson, R. Chilukuri, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 5

Implementation of a Fully Molded Fan-Out Packaging Technology

2013 · B. Rogers, C. Scanlan, et al. · Wafer-Level Packaging Symposium · 3

Manufacturability and reliability study of ALX polymers for WLP applications

2010 · Alan Huffman, Philip Garrou, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3

Adaptive Patterning for Panelized Packaging

2012 · C. Scanlan, B. Rogers, et al. · Wafer-Level Packaging Symposium · 1

Rapid Polymer Curing for Improved Manufacturing Metrics

2016 · J. Yusi, B. Rogers, et al. · Wafer-Level Packaging Symposium

M-Series with Adaptive Patterning for High-Yield Fan-Out SIP

2016 · Craig Bishop, Suresh Jayaraman, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Works count: 12

Citation count: 160

H-index: 6

I10-index: 5