Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test
Year: 2008
Type: conference-paper
Authors: Tong Yan Tee, Bin Tan Long, Rex Anderson, Shen Ng Hun, Jim Hee Low, Choong Peng Khoo, Robert Moody, Boyd Rogers
Institution: Amkor Technology (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2015409550