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Shen Ng Hun
Institution:
Amkor Technology (United States)
Observed institution:
Amkor Technology (United States)
OpenAlex ID:
A5114933982
Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test
2008
·
Tong Yan Tee
, Bin Tan Long
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
37
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Citation count:
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