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Attila Géczy

Monitoring multi-respiratory indices via a smart nanofibrous mask filter based on a triboelectric nanogenerator
2021 · Haijun He, Jian Guo, et al. · Nano Energy · 77
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Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
2024 · Csaba Farkas, László Gál, et al. · Sustainable materials and technologies · 49
Biodegradable Substrates for Rigid and Flexible Circuit Boards: A Review
2024 · Karel Dušek, Daniel Koc, et al. · Advanced Sustainable Systems · 46
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Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
2021 · Balázs Illés, Bálint Medgyes, et al. · International Journal of Heat and Mass Transfer · 44
Multi-physics modelling of a vapour phase soldering (VPS) system
2012 · Balázs Illés, Attila Géczy · Applied Thermal Engineering · 43
Corrosion problems of SAC-SiC composite solder alloys
2023 · Halim Choi, Balázs Illés, et al. · Corrosion Science · 41
Advances in Producing Functional Circuits on Biodegradable PCBs
2016 · Bálint Kovács, Attila Géczy, et al. · Periodica Polytechnica Electrical Engineering and Computer Science · 37
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Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors
2023 · Zoltán Tafferner, Balázs Balázs, et al. · Sensors · 36
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Investigating the dynamic changes of the vapour concentration in a Vapour Phase Soldering oven by simplified condensation modelling
2013 · Balázs Illés, Attila Géczy · Applied Thermal Engineering · 36
Investigations on Vapor Phase Soldering Process in an Experimental Soldering Station
2010 · Attila Geczy, Zsolt Illyefalvi-Vitez, et al. · Micro and Nanosystems · 36
A review on current eCall systems for autonomous car accident detection
2017 · Attila Bonyar, Attila Geczy, et al. · International Spring Seminar on Electronics Technology · 35
Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
2011 · Attila Geczy, Vilmos Lener, et al. · International Spring Seminar on Electronics Technology · 33
Impact of Electromigration and Isothermal Ageing on Lead-Free Solder Joints of Chip-Sized Smd Components
2022 · Dániel Straubinger, Tamás Hurtony, et al. · Journal of Materials Research and Technology · 31
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Biodegradable and Nanocomposite Materials as Printed Circuit Substrates: A Mini-Review
2022 · Attila Geczy, Csaba Farkas, et al. · IEEE Open Journal of Nanotechnology · 31
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Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
2017 · Balázs Illés, Agata Skwarek, et al. · International Journal of Heat and Mass Transfer · 29
Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering
2016 · Balázs Illés, Attila Géczy, et al. · International Journal of Heat and Mass Transfer · 29
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
2016 · Attila Géczy, Bíborka Kvanduk, et al. · Soldering and Surface Mount Technology · 29
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
2013 · Attila Géczy, Balázs Illés, et al. · International Journal of Heat and Mass Transfer · 29
Conductive layer deposition and peel tests on biodegradable printed circuit boards
2012 · Attila Geczy, Mark Kovacs, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 27
Numerical simulation of condensate layer formation during vapour phase soldering
2014 · Balázs Illés, Attila Géczy · Applied Thermal Engineering · 26
Underfill: A Review of Reliability Improvement Methods in Electronics Production
2025 · Zbyněk Plachý, Anna Pražanová, et al. · Polymers · 25
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Late Shelf Life Saturation of Golden Delicious Apple Parameters: TSS, Weight, and Colorimetry
2022 · Salma Kassebi, Csaba Farkas, et al. · Applied Sciences · 25
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Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
2017 · Attila Géczy · International Journal of Heat and Mass Transfer · 25
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
2015 · Attila Geczy, Márta Fejos, et al. · Soldering and Surface Mount Technology · 23
Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study
2024 · Attila Géczy, Dániel Piffkó, et al. · Nanotechnology · 22
Works count: 206
Citation count: 1,713
H-index: 23
I10-index: 56
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