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Shengyung Wang
Observed names:
S. Wang,
Siyu Wang
Institution:
Feng Chia University
Observed institutions:
Johns Hopkins University,
Hefei University of Technology,
Chinese Academy of Sciences,
Johns Hopkins Medicine,
Changchun Institute of Optics, Fine Mechanics and Physics,
IMEC,
Feng Chia University
show all 7
ORCID:
0009-0006-6179-6307
Observed ORCID:
0009-0006-6179-6307
OpenAlex ID:
A5011587381
First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers
2020
·
S. Subramanian
, M. Hosseini
, et al.
·
Symposium on VLSI Technology
·
144
Nanosheet-based Complementary Field-Effect Transistors (CFETs) at 48nm Gate Pitch, and Middle Dielectric Isolation to enable CFET Inner Spacer Formation and Multi-Vt Patterning
2023
·
H. Mertens
, M. Hosseini
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
73
Buried Power Rail Metal exploration towards the 1 nm Node
2021
·
A. Gupta
, D. Radisic
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
26
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
2022
·
A. Veloso
, A. Jourdain
, et al.
·
IEEE Transactions on Electron Devices
·
25
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
2024
·
P. Zhao
, L. Witters
, et al.
·
IEEE Transactions on Electron Devices
·
21
Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
2020
·
A. Gupta
, O. Varela Pedreira
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
17
Integration of a Stacked Contact MOL for Monolithic CFET
2023
·
Victor Vega-Gonzalez
, D. Radisic
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
16
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
2022
·
A. Veloso
, A. Jourdain
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
13
Lightweight high-throughput true random number generator based on state switchable ring oscillator
2024
·
Shehui Wu
, Huaguo Liang
, et al.
·
Integration
·
12
Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias
2024
·
P. Zhao
, L. Witters
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
3
Rodent Forelimb Model of Direct Neurotization for Improved Studies of Muscle Reinnervation and Prosthesis Control
2023
·
Kiara N. Quinn
, Pierce L. Perkins
, et al.
·
International IEEE/EMBS Conference on Neural Engineering
·
3
Design of the Space Camera Protection System during Launch Process
2023
·
Siyu Wang
, Haiying Tian
, et al.
·
International Journal of Aerospace Engineering
·
2
PDF
Channel selection and wavelet transformation-based data compression preserve motor unit information
2024
·
Siyu Wang
, Kiara N. Quinn
, et al.
·
Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
·
1
An Improved Monolithic GaN-Based Optocoupler With Annular Interdigitated Microstructures
2025
·
Jhihfong Liou
, Yuwei Chen
, et al.
·
IEEE Sensors Letters
Monolithic GaN-based Optocoupler with Annular Interdigitated Microstructures
2025
·
Shengyung Wang
, Jhihfong Liou
, et al.
·
International Conference on Optical MEMS and Nanophotonics
Separation of fascicles for motor unit separability in reinnervated muscles for neuroprosthesis application
2024
·
Lang Qin
, Siyu Wang
, et al.
·
Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
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Works count:
16
Citation count:
356
H-index:
9
I10-index:
9
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