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Steven G. Rosser
Observed names:
S. Rosser,
S.G. Rosser,
Steven Rosser
Observed institution:
IBM (United States)
OpenAlex ID:
A5014082922
Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages
2005
·
F.D. Egitto
, S.R. Krasniak
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
19
Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
2006
·
M.J. Rowlands
, S.G. Rosser
·
IEEE Electronic Components and Technology Conference (ECTC)
·
15
Modeling and simulation of 12.5 Gb/s on a HyperBGA/sup /spl reg// package
2004
·
R.D. McBride
, S.G. Rosser
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
13
Measurement and simulation of simultaneous switching noise in the multi-reference plane package
2002
·
S.G. Rosser
, M.K. Kerr
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics
2013
·
Rabindra N. Das
, Frank D. Egitto
, et al.
·
IMAPSource Proceedings
·
7
Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 μm CMOS test chip
2002
·
T. Budell
, J. Audet
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Fabrication and electrical characterization of embedded actives and passives for system level analysis: Towards Size, Weight and Power (SWaP) reduction
2012
·
Rabindra N. Das
, Steven G. Rosser
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
PWB solutions for High Speed Systems
2005
·
B. Chan
, J. Lauffer
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Design, Fabrication, Electrical Characterization and Reliability of Nanomaterials Based Embedded Passives
2010
·
Rabindra N. Das
, John M. Lauffer
, et al.
·
IMAPSource Proceedings
·
3
Resin coated copper capacitive (RC3) nanocomposites for system in a package (SiP): Development of 3-8-3 structure
2009
·
Rabindra N. Das
, Konstantinos I. Papathomas
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors
2008
·
Rabindra N. Das
, Steven G. Rosser
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Advanced organic substrate technologies for HiRel and medical applications
2013
·
Frank D. Egitto
, Dave Alcoe
, et al.
·
2
3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics
2013
·
Rabindra Das
, Frank D. Egitto
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
2
Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization
2013
·
Susan Bagen
, Dave Alcoe
, et al.
·
SMTA International
·
1
Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)
2009
·
Rabindra N. Das
, Steven G. Rosser
, et al.
·
Circuit World
·
1
Migrating Printed Wiring Board Assemblies into System in a Package (SiP)
2026
·
Steven G. Rosser
, Irving Memis
, et al.
·
IMAPSource Proceedings
PDF
Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices
2013
·
Rabindra Das
, Steven Rosser
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
PDF
Z-Axis Interconnection in Organic Packaging
2011
·
Frank Egitto
, T. Antesberger
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Comparison of Multilayer Organic and Ceramic Package Simultaneous Switching Noise Measurements using a 0.16 µ
2001
·
T. Budell
, Jean Audet
, et al.
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Works count:
21
Citation count:
95
H-index:
6
I10-index:
4
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