Author

Shunfeng Han

Observed name: S. F. Han

Observed institutions: China State Shipbuilding (China), Guilin University of Electronic Technology

OpenAlex ID: A5014449601

High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere

2025 · Bofu Li, Yinyin Luo, et al. · Processes · 5

The latest research status and prospect on microwave technology for monitoring concerned brain activity

2015 · Xiang Wan, Daoguo Yang, et al. · IEEE International Conference on Mechatronics and Automation (ICMA) · 5

The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging

2025 · Dejian Li, Bofu Li, et al. · Micromachines · 4

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Vertical Thermal Design and Modeling for Integrated Power Amplifier WBLGA SiP Packaging

2024 · Bofu Li, DeJian Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules

2021 · Qi Zheng, Huimin He, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Thermal modeling and analysis for a novel packaging structure of CMOS image sensor

2016 · S. F. Han, D.G. Yang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3

Effect of Chip Package Interaction on Cu/Ultralow-k Interconnect Fracture in Flip Chips

2024 · Bofu Li, Dameng Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Optimization of Package Heat Dissipation Design Based on High-power WB-BGA Industrial Chip with a Wide Temperature Range

2023 · Shihua Duan, Dejian Li, et al. · Journal of Physics Conference Series · 1

A novel pin-pull tester and its application on PCB pad cratering assessment

2015 · Nanbo Li, Miao Cai, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Delamination behavior of back end of line in flip-chip chip scale package by notched four point bending test and finite element analysis

2026 · Pei Chen, Chang Yu, et al. · Microelectronics Reliability

Analysis of Silver Sintering Processes Using Microfine Gas Flow-Assisted Pressure Sintering

2025 · Siyu Wu, Jianna Zheng, et al. · China International Forum on Solid State Lighting & International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

WBLGA SiP High-Reliability and High-Thermal Conductivity Design Optimization and Interconnect Process Exploration

2025 · Dejian Li, Bofu Li, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Fast Extraction of Chip Thermal Resistances for Advanced Packaging Design

2025 · Boyuan Yu, Zhixiao Jiang, et al. · Photonics & Electromagnetics Research Symposium - Spring (PIERS-Spring)

Characterization Analysis for High-Temperature Evolution Features of Fine Silver Sintered Joints

2024 · Yuting Zhang, Miao Cai, et al. · International Conference on Electronic Packaging Technology (ICEPT)

A High-Resolution Large Swing Signal Generation Test Method for ADC Automatic Testing

2024 · Bofu Li, Dameng Li, et al. · International Conference on Electronic Technology and Information Science (ICETIS)

Portable underwater audio communication system based on blue LEDs

2023 · Shunfeng Han, Jia Li, et al. · International Photonics and Optoelectronics Meetings

Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package

2022 · Shunfeng Han, Dejian Li, et al. · International Conference on Electronic Packaging Technology (ICEPT)

The multi-dimension co-design for the package of the high-speed multi-function chip

2021 · Yuan Guan, Yubo Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Adaptive rate binning in real time transmission

2015 · Shunfeng Han, Min Du · IEEE International Conference on Imaging Systems and Techniques (IST)

Works count: 19

Citation count: 26

H-index: 3

I10-index: