Author

Fabian Huber

Observed names: F. Huber, Huber, Fabian Clemens

Observed institutions: AMS (Austria), Graz University of Technology

ORCID: 0000-0003-0589-0383

Observed ORCID: 0000-0003-0589-0383

OpenAlex ID: A5014888633

Warpage Optimization of Package Substrates Using Metamodels - A Review

2024 · Fredy John Porathur, Vikram G Kamble, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 11

A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging

2020 · Fabian Huber, Harald Etschmaier, et al. · International Journal of Polymer Analysis and Characterization · 11

Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging

2020 · Fabian Huber, Harald Etschmaier, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 6

Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.

2023 · R. Kniely, J. Heilmann, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

Characterization of interfacial parameters for lifetime modelling in modern optical sensor package assemblies

2022 · R. Kniely, F. Huber, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition

2021 · Fabian Huber, Harald Etschmaier, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

Characterization of Moisture Uptake in Microelectronics Packaging Materials

2018 · Fabian Huber, Harald Etschmaier, et al. · Electronic System-Integration Technology Conference (ESTC) · 2

Hygroscopic Swelling Influence on Critical Sensor Components: Experimental Characterization and FEA Application.

2024 · Valentina Troncale, Fabian Huber · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1

Transformer-Enhanced Metamodels for Optimizing Material, Geometric, and Process Temperature Features in Warpage Control of Package-on-Package Assemblies

2026 · Fredy Porathur, Fabian Huber, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Warpage Reduction of Laminate Substrates Through Metamodel-Based Optimization of Material Properties

2025 · Fredy Porathur, Fabian Huber, et al. · European Microelectronics and Packaging Conference

Works count: 12

Citation count: 37

H-index: 3

I10-index: 2