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David P. Vallett
Observed names:
D. P. Vallett,
D. Vallett,
D.P. Vallett,
David Vallett
Observed institutions:
IBM (United States),
GlobalFoundries (United States)
OpenAlex ID:
A5019000106
Picosecond imaging circuit analysis
2000
·
J. C. Tsang
, J. A. Kash
, et al.
·
IBM Journal of Research and Development
·
73
Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment
2003
·
P. Nigh
, D. Vallett
, et al.
·
IEEE International Test Conference (ITC)
·
53
IC failure analysis: the importance of test and diagnostics
1997
·
D.P. Vallett
·
IEEE Design & Test of Computers
·
47
Failure analysis of timing and IDDq-only failures from the SEMATECH test methods experiment
2002
·
P. Nigh
, D. Vallett
, et al.
·
IEEE International Test Conference (ITC)
·
39
Time-resolved optical characterization of electrical activity in integrated circuits
2000
·
J.C. Tsang
, J.A. Kash
, et al.
·
Proceedings of the IEEE
·
27
Diagnosis and characterization of timing-related defects by time-dependent light emission
2002
·
D. Knebel
, P. Sanda
, et al.
·
IEEE International Test Conference (ITC)
·
24
Failure analysis requirements for nanoelectronics
2002
·
D.P. Vallett
·
IEEE Transactions on Nanotechnology
·
23
Finding fault with deep-submicron ICs
1997
·
D.P. Vallett
, J.M. Soden
·
IEEE Spectrum
·
17
An overview of CMOS VLSI failure analysis and the importance of test and diagnostics
2002
·
D.P. Vallett
·
IEEE International Test Conference (ITC)
·
16
Scanning SQUID Microscopy for Die Level Fault Isolation
2002
·
David P. Vallett
·
Proceedings - International Symposium for Testing and Failure Analysis
·
16
Non-Invasive Backside Failure Analysis of Integrated Circuits by Time-Dependent Light Emission: Picosecond Imaging Circuit Analysis
1998
·
J.A. Kash
, J.C. Tsang
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
16
A Comparison of Lock-in Thermography and Magnetic Current Imaging for Localizing Buried Short-Circuits
2011
·
David P. Vallett
·
Proceedings - International Symposium for Testing and Failure Analysis
·
12
Enhanced Comparison of Lock-In Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages
2012
·
Christian Schmidt
, Frank Altmann
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
9
Probing the Future of Failure Analysis
2002
·
David P. Vallett
·
EDFA Technical Articles
·
8
Why Waste Time on Roadmaps When We Don't Have Cars?
2007
·
David P. Vallett
·
IEEE Transactions on Device and Materials Reliability
·
6
Localization of Dead Open in a Solder Bump by Space Domain Reflectometry
2012
·
David P. Vallett
, Daniel A. Bader
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
5
High-Resolution Backside GMR Magnetic Current Imaging on a Contour-Milled Globally Ultrathin Die
2014
·
D. Vallett
, J. Gaudestad
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
4
Failure analysis requirements for nanoelectronics
2003
·
D.P. Vallett
·
IEEE Conference on Nanotechnology (IEEE NANO)
·
4
FA Future Requirements
1999
·
David P. Vallett
·
Springer eBooks
·
4
Magnetic Field Imaging for Non-Destructive 3D Package Fault Isolation
2014
·
Jan Gaudestad
, David Vallett
·
IMAPSource Proceedings
·
3
Quantitative Analysis and Depth Measurement via Magnetic Field Imaging
2005
·
Benaiah D. Schrag
, Xiaoyong Liu
, et al.
·
EDFA Technical Articles
·
3
From Microns to Molecules – Can FA Remain Viable Through the Next Decade?
2002
·
David P. Vallett
·
Proceedings - International Symposium for Testing and Failure Analysis
·
3
Future challenges in IC testing and fault isolation
2004
·
D.P. Vallett
·
IEEE Lasers and Electro-Optics Society Annual Meeting (LEOS)
·
2
Reliability test failure analysis using advance FA techniques on Cu wire bonded devices
2015
·
L. Zhang
, T. C. Chai
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Fault isolation challenges and opportunities for proximal-probe imaging
2012
·
D. P. Vallett
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
1
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Works count:
28
Citation count:
416
H-index:
12
I10-index:
12
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