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Omar Hasan Ahmed

Observed name: Omar Ahmed
ORCID: 0000-0002-4161-8558
Observed ORCID: 0000-0002-4161-8558
OpenAlex ID: A5019452864
The interfacial reliability of through-glass vias for 2.5D integrated circuits
2020 · Omar Ahmed, Golareh Jalilvand, et al. · Microelectronics International · 33
The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study
2020 · Omar Ahmed, Chukwudi Okoro, et al. · Multidiscipline Modeling in Materials and Structures · 30
In situ TEM Characterization of Microstructure Evolution and Mechanical Behavior of the 3D-Printed Inconel 718 Exposed to High Temperature
2021 · Supriya Koul, Le Zhou, et al. · Microscopy and Microanalysis · 16
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Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications
2024 · Vishnu Shukla, Omar Ahmed, et al. · Metals · 15
The Effect of Pitch Distance on the Statistics and Morphology of Through-Silicon Via Extrusion
2021 · Golareh Jalilvand, Omar Ahmed, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 12
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Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn–Ag–Cu–Bi Solder
2024 · Vishnu Shukla, Omar Ahmed, et al. · Materials · 11
The effective control of Cu through-silicon via extrusion for three-dimensional integrated circuits by a metallic cap layer
2019 · Golareh Jalilvand, Omar Ahmed, et al. · Scripta Materialia · 9
Corrosion Behaviour of AISI 304 Stainless Steel with Solar Salt Heat Transfer Fluid
2014 · Omar Ahmed, Le Zhou, et al. · Advanced materials research · 9
Corrosion Behaviour Of Aisi 304 Stainless Steel In Contact With Eutectic Salt For Concentrated Solar Power Plant Applications
2013 · Omar Ahmed · Journal of International Crisis and Risk Communication Research · 9
Study of the Impact of Pitch Distance on the Statistical Variation of TSV Protrusion and the Underlying Mechanisms
2020 · Golareh Jalilvand, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Effects of Heatsink Application and PCB Design Variations on BGA Solder Joint Reliability
2021 · Omar Ahmed, Leif Hutchinson, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys
2021 · Vishnu Shukla, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Application of a Metallic Cap Layer to Control Cu TSV Extrusion
2017 · Golareh Jalilvand, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Design-for-Manufacturing and Design-for-Reliability Strategies for Large 80mm+ 2.5D Devices
2023 · Peng Su, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
An Effective and Application-Specific Evaluation of Low-k Dielectric Integration Integrity using Copper Pillar Shear Testing
2020 · Arman Ahari, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias
2020 · Omar Ahmed, Golareh Jalilvand, et al. · IEEE Transactions on Device and Materials Reliability · 4
Electromigration Lifetime Improvement of Ball Grid Array Solder Joints for High Performance Computing Applications
2025 · Vishnu Shukla, Andrea Molina Moreno, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys
2022 · Vishnu Shukla, Nicholas Ayers, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs
2023 · Peng Su, Omar Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application Conditions
2019 · Omar Ahmed, Golareh Jalilvand, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Study of the Long Term Reliability of 3D IC under Near-Application Conditions
2018 · Omar Ahmed, Golareh Jalilvand, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Simulation-Assisted Board Level Solder Joint Reliability Optimization for Large 80mm+ 2.5D Devices
2023 · Omar Ahmed, Vishnu Shukla, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Evaluation of Low-k Integration Integrity Using Shear Testing on Sub-30 Micron Micro-Cu Pillars
2021 · Tae-Kyu Lee, Greg Baty, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Reinforcement Learning for Adaptive Traffic Management in Smart Cities
2026 · Abizer Safdari, Omar Hasan Ahmed, et al. · Innovations in Machine, Engineering, and Digital Conference (IMED)
Building Brand Equity Through Sustainable and Experiential Marketing
2026 · Omar Hasan Ahmed, Nadia Tareq Ahmed, et al. · Environment and Social Psychology
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Works count: 27
Citation count: 196
H-index: 9
I10-index: 6
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