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Mustafa Oezkoek
Institution:
Atotech (Germany)
Observed institutions:
Atotech (Germany),
Atotech (United States)
OpenAlex ID:
A5021465566
Benefits of pure palladium for ENEP and ENEPIG surface finishes
2010
·
Mustafa Oezkoek
, Gustavo Ramos
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
7
Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire Bonding
2010
·
Mustafa Oezkoek
, Hugh Roberts
, et al.
·
IMAPSource Proceedings
·
4
Copper wire bond investigation on multiple surface finishes - enabling wire bond packages without gold
2011
·
Mustafa Oezkoek
, Nigel D. White
, et al.
·
European Microelectronics and Packaging Conference
·
3
Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced Packaging
2025
·
Dennis Fiedler
, Grigory Vazhenin
, et al.
·
IMAPSource Proceedings
·
1
PDF
Tool-Agnostic Pulse Reverse Electroplating for High Aspect Ratio Through Glass Vias in Advanced Packaging
2025
·
Dennis Fiedler
, Grigory Vazhenin
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding
2014
·
Mustafa Oezkoek
, Gustavo RamosArnd
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
1
Pure palladium in ENEPIG surface finishes — Physical properties of the Pd deposition and their influence on soldering and wire bonding
2010
·
Bill Kao
, Mustafa Oezkoek
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Soldering Evaluations on the New Direct Palladium Gold Finish (EPAG)
2014
·
Arnd Kilian
, Petra Schreier
, et al.
·
SMTA International
Immersion Tin Surface Finish – Reviewing the Past and a Look to the Future
2014
·
Mustafa Oezkoek
, Hubertus Mertens
, et al.
·
SMTA International
Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.
2013
·
Maren Bruder
, Guenter Heinz
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
The Benefits of Pure PD Layers in ENEP and ENEPIG Surface Finishes
2011
·
Mustafa Oezkoek
, Gustavo Ramos
, et al.
·
Regional Events
Electroless Pure Palladium Deposition On Copper As A Cu Wire Bondable Surface Finish
2011
·
Mustafa Oezkoek
, Arnd Kilian
, et al.
·
SMTA International
Ageing characteristics of Cu Wire Bonds on Palladium Surface Finishes
2011
·
Mustafa Oezkoek
, Horst Clauberg
, et al.
·
IMAPSource Proceedings
The Benefits of ENEPIG with Pure Pd for Gold Wire Bonding
2010
·
Mustafa Oezkoek
, Gustavo Ramos
, et al.
·
SMTA International
ENEP – A Cost-Effective Alternative for High Reliability Soldering Applications
2010
·
Gustavo Ramos
, Mustafa Oezkoek
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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Works count:
15
Citation count:
18
H-index:
3
I10-index:
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