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C. Q. Chen

Observed names: C.Q. Chen, Chi-ming Chen
ORCID: 0009-0006-2512-4917
Observed ORCID: 0009-0006-2512-4917
OpenAlex ID: A5021598483
Early detection of systematic patterning problems for a 22nm SOI technology using E-beam hot spot inspection
2013 · Oliver D. Patterson, Deborah A. Ryan, et al. · ASMC proceedings · 15
Nanoprobing EBAC technique to reveal the failure root cause of gate oxide reliability issues of an IC process
2014 · P. K. Tan, M. K. Dawood, et al. · IEEE International Integrated Reliability Workshop final report · 11
FIB sample preparation for TEM failure analysis of advanced devices
2010 · J. Zhu, Q. X. Wang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 6
Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system
2016 · Y.Z. Zhao, Q.J. Wang, et al. · Microelectronics Reliability · 5
Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis
2016 · C. Q. Chen, P. T. Ng, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 5
Advantage of AFP Nanoprobing on the 28 nm Technology Failure Analysis
2013 · C.Q. Chen, G.B. Ang, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 5
Non-Visible Defect Analysis of OTP Device
2011 · C.Q. Chen, G.B. Ang, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 4
Simple Circuit Edit Passive Voltage Contrast Technique to Identify Leakage Location
2020 · S.L. Ting, P.K. Tan, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Enhancing die level static fault isolation on power gated devices
2020 · D. Nagalingam, A.C.T. Quah, et al. · Microelectronics Reliability · 3
Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect
2017 · S.P. Neo, A.C.T. Quah, et al. · Microelectronics Reliability · 3
Enhanced Static Fault Localization Methodology on Resistive Open Defects Using Photon Emission Microscopy and Layout Defect Prediction
2016 · A.C.T. Quah, D. Nagalingam, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Failure Analysis Methodology on Circular Patch Functional Failure Due to Device Parametric Drift
2015 · A.C.T. Quah, C.Q. Chen, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Static fault localization on Memory failures using Photon Emission Microscopy
2015 · N. Dayanand, A. C. T. Quah, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Sample Preparation in Recover Physical Defects on MIM Related failure for Different Devices In Wafer Fabrication
2019 · H. P. Ng, N.Y. Xu, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Failure Analysis Case Studies on Wafer Edge Failure due to Process Uniformity Issue
2018 · N.Y. Xu, H.P. Ng, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Electrical simulation on the localized NVM failed cell by AFP nanoproing
2015 · C. Q. Chen, G.B. Ang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Applications of Nanoprobing for Localization of Design for Manufacturing Issues on Analogue-to-Digital Converter on Advanced Technology Node
2013 · A.C.T. Quah, C.Q. Chen, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2
Novel and Simple Cross-sectional FIB Circuit Edit Techniques for Circuit Isolation
2022 · P. K. Tan, Y. L. Pan, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Enhanced EBAC Detection on Gate Oxide Breakdown Isolation after High Voltage Electron Beam Irradiation
2022 · P. T. Ng, F. Rivai, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Application of Nanoprobing on Subtle Defects in the Embedded Non-Volatile Memory Device
2019 · C. Q. Chen, P. T. Ng, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 1
Achieving Simplified Biasing Conditions with Pin Reduction Approach to enhance Static Fault Localization Capability
2018 · SJ. Moon, A.C.T. Quah, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern
2017 · C.Q. Chen, G.B. Ang, et al. · Microelectronics Reliability · 1
SRAM VMIN yield challenge in 40nm embedded NVM process
2015 · L. Q. Luo, D. X. Wang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1
Investigation of Protection Layer Materials for Ex-Situ Lift-Out TEM Sample Preparation with FIB for 14 nm FinFET
2014 · H. Feng, G.R. Low, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 1
Failure Analysis Methodology on Resistive Open Defects
2014 · A.C.T. Quah, G.B. Ang, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 1
Works count: 58
Citation count: 86
H-index: 5
I10-index: 2
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