Author

N. Owens

Observed names: N. L. Owens, N.L. Owens, NORM OWENS, Norman L Owens, Norman L. Owens

Institution: NXP (France)

Observed institutions: Motorola (United States), NXP (France), American Society for Indexing

OpenAlex ID: A5021989495

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

2008 · E.H. Wong, C.S. Selvanayagam, et al. · Journal of Electronic Materials · 80

Advances in the drop-impact reliability of solder joints for mobile applications

2009 · E.H. Wong, S.K.W. Seah, et al. · Microelectronics Reliability · 64

Correlation studies for component level ball impact shear test and board level drop test

2008 · E.H. Wong, R. Rajoo, et al. · Microelectronics Reliability · 40

Stress–strain characteristics of tin-based solder alloys at medium strain rate

2008 · E.H. Wong, C.S. Selvanayagam, et al. · Materials Letters · 40

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

2007 · Jin-Wook Jang, Ananda P. De Silva, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 31

Emerging reliability challenges in electronic packaging

2008 · D. R. Frear, L. N. Ramanathan, et al. · IEEE International Reliability Physics Symposium proceedings · 28

A study of crack propagation in Pb-free solder joints under drop impact

2008 · J.F.J. Caers, E.H. Wong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 · E.H. Wong, S.K.W. Seah, et al. · Journal of Electronic Materials · 24

A Study of Crack Propagation in Pb-Free Solder Joints

2010 · J. F. J. M. Caers, X. J. Zhao, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 18

Recent advances in drop-impact reliability

2008 · E. H. Wong, S. K. W. Seah, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13

Potential Failure Modes and Effects Analysis: a Business Perspective

1994 · MARK HATTY, NORM OWENS · Quality Engineering · 9

Package Material Selection Criteria for High Temperature Automotive Applications

2019 · R.T.H. Rongen, A. Mavinkurve, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7

A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

2008 · Yi-Shao Lai, E. H. Wong, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5

Failure Modes & Effective Analysis And Continuous Improvement

2005 · M. Hatty, N. Owens · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 3

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

2008 · S.K.W. Seah, E.H. Wong, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates

2007 · C. S. Selvanayagam, E.H. Wong, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Design for manufacturability in hermetic product die attach

1988 · N.L. Owens · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2

Near-CSP plastic ball grid array

2000 · Norman L Owens · Microelectronics Reliability

Works count: 18

Citation count: 394

H-index: 10

I10-index: 10