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Author

Marco Erstling

Observed names: Erstling Marco, M. Erstling
Institution: X-Fab (Germany)
OpenAlex ID: A5022521338
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization
2016 · Verena Hein, Marco Erstling, et al. · Microelectronics Reliability · 11
Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks
2017 · Raj Sekar Sethu, Verena Hein, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 8
Design and verification of analog CMOS circuits using the gm/ID-method with age-dependent degradation effects
2016 · Theodor Hillebrand, Timur Schafer, et al. · International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS) · 8
An aging-aware transistor sizing tool regarding BTI and HCD degradation modes
2015 · Nico Hellwege, Nils Heidmann, et al. · International Conference Mixed Design of Integrated Circuits and Systems · 7
Life time characterization for a highly robust metallization
2015 · K. Weide-Zaage, Kludt, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5
Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices
2021 · Sanjay Shrirang Mane, Kok Heng Soon, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 4
Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing
2019 · Raj Sekar Sethu, Lars Bergmann, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing
2019 · Sanjay Shrirang Mane, Raj Sekar Sethu, et al. · Microelectronics Reliability · 3
Differences in reliability effects for thick copper and thick aluminium metallizations
2017 · Martin Pohl, Marco Erstling, et al. · IEEE International Reliability Physics Symposium proceedings · 3
A Design for Highly Robust AlCu - W-Plug - Metallization Stack
2016 · V. Hein, M. Ackermann, et al. · Pan Pacific Symposium · 3
Design and Verification of Analog CMOS Circuits Using the gm/ID-Method with Age-Dependent Degradation Effects
2017 · Timur Schäfer, Theodor Hillebrand, et al. · Journal of Low Power Electronics · 1
ALCU-metal heater for interconnect monitoring test structures
2016 · Verena Hein, Marco Erstling · Pan Pacific Symposium · 1
Stress Effect of Wafer Fabrication BEOL Structures On Polysilicon: A Piezoeletric Phenomenon
2019 · Sanjay Shrirang Mane, Raj Sekar Sethu, et al. · IEEE International Nanoelectronics Conference
プローブによるimd応力に関するトップ金属厚さの数値シミュレーション【jst・京大機械翻訳】
2019 · Sethu Raj Sekar, Bergmann Lars, et al. · IEEE Conference Proceedings
4本足間接マトリックスコンバータのための瞬時無効電力最小化を用いた予測電流制御【Powered by NICT】
2017 · F Garcia Cristian, Erstling Marco, et al. · IEEE Transactions on Industrial Electronics
年齢依存性分解効果を持つg_m/I_D法を用いたアナログCMOS回路の設計と検証【Powered by NICT】
2016 · Hillebrand Theodor, Schafer Timur, et al. · IEEE Conference Proceedings
高度にロバストなメタライゼーションの要素としてのタングステンドーナツバイアの信頼性評価【Powered by NICT】
2016 · Verena Hein, Erstling Marco, et al. · Microelectronics Reliability
相互接続モニタリングテスト構造のためのALCU金属ヒータ【Powered by NICT】
2016 · Verena Hein, Erstling Marco · IEEE Conference Proceedings
Works count: 18
Citation count: 58
H-index: 5
I10-index: 1
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