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Yung-Sheng Zou

Observed names: Y. S. Zou, Yung Sheng Zou
Institution: Micron (Taiwan)
ORCID: 0000-0002-7778-9201
Observed ORCID: 0000-0002-7778-9201
OpenAlex ID: A5022766145
Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
2024 · Vance Liu, Yung-Sheng Zou, et al. · Materials Science in Semiconductor Processing · 24
Technological sustainable materials and enabling in semiconductor memory industry: A review
2023 · Chong Leong Gan, Min-Hua Chung, et al. · e-Prime - Advances in Electrical Engineering Electronics and Energy · 11
A review on future novel interconnect and polymeric materials for cryogenic memory packaging
2023 · C. L. Gan, Chen Yu Huang, et al. · Journal of Materials Science Materials in Electronics · 6
Effects of Sb and Bi addition on IMC morphology and reliability of Pb-free solder/Cu-OSP
2021 · Y. S. Zou, M. H. Chung, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement
2023 · Yun-Ting Hsu, Yung-Sheng Zou, et al. · International Conference on Electronics Packaging (ICEP) · 4
Innovations needed, reliability issues, and technical challenges in the development of electronic materials for future AI humanoid robots: a critical assessment
2025 · C. L. Gan, M. H. Chung, et al. · Journal of Materials Science Materials in Electronics · 3
Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products
2023 · Yun-Ting Hsu, Yung-Sheng Zou, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board
2022 · Y. S. Zou, M. H. Chung, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
Intermetallic Growth Kinetics of Recycled Gold Bonding Wire
2024 · Yi Jing Chen, Yung Sheng Zou, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Works count: 9
Citation count: 58
H-index: 4
I10-index: 2
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