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Alec J. Babiarz
Observed names:
A. Babiarz,
Alec Babiarz
OpenAlex ID:
A5023469407
Conductive Adhesive Dispensing Process Considerations
1999
·
A. F. Lewis
, A. Babiarz
·
10
Chip scale packaging reliability
2002
·
H. Quinones
, A. Babiarz
·
International Symposium on Electronic Materials and Packaging (EMAP)
·
9
Jetting Technology for Microelectronics
2015
·
Horatio Quinones
, Alec Babiarz
, et al.
·
5
Jetting technology: a way of the future in dispensing
2003
·
H. Quinones
, A. Babiarz
, et al.
·
International Symposium on Electronic Materials and Packaging (EMAP)
·
5
Best practices in automated underfill dispensing
2002
·
A. Lewis
, A. Babiarz
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Encapsulation Technology for 3D Stacked Packages
2002
·
Horatio Quinones
, Alec Babiarz
, et al.
·
Pan Pacific Symposium
·
2
Fast underfill processes for large to small flip chips.
2001
·
A. Babiarz
, Horatio Quinones
, et al.
·
1
Jetting Fluids in A Wide Variety of New Electronic and Semiconductor Non-Traditional Packaging and Assembly Applications
2009
·
Alec J. Babiarz
·
Pan Pacific Symposium
Silicone-Phosphor Encapsulation for High Power White LEDs
2008
·
Horatio Quinones
, Brian Sawatzky
, et al.
·
Pan Pacific Symposium
Enabling Technologies for Applying Fluids in Semiconductor Packaging
2007
·
Alec J. Babiarz
, Horatio Quinones
·
Wafer-Level Packaging Symposium
Jetting Adhesives and other Materials for Semiconductor and Electronic Component Packaging
2007
·
Alec J. Babiarz
·
Pan Pacific Symposium
Advances in Jetting Small Dots of High Viscosity Fluids for Electronic and Semiconductor Packaging
2006
·
Alec J. Babiarz
·
Pan Pacific Symposium
Paradigm Shift in Applying Underfill-Update
2005
·
Alec J. Babiarz
·
SMTA International
Paradigm Shift in Applying Underfill
2005
·
Alec J. Babiarz
·
Pan Pacific Symposium
Jetting: Discrete Dispensing of High Viscosity Fluid
2004
·
Horatio Quinones
, Alec Babiarz
, et al.
·
Pan Pacific Symposium
Automating Underfill for Non-Traditional Packages, Secondary CSP Underfill, Stacked Die, and No-Flow Underfill
2000
·
Alan R. Lewis
, Alec J. Babiarz
, et al.
·
Journal of Surface Mount Technology
Assessment of Liquid Encapsulated and Transfer Molded Wirebonded Cavity Filled Packages
2000
·
Lisa Ryan
, Brian Lynch
, et al.
·
Pan Pacific Symposium
Automating Underfill for Non-Traditional Packages, Secondary CSP Underfill, Stacked Die, and No-Flow Underfill
2000
·
Alec J. Babiarz
, Alan R. Lewis
, et al.
·
Pan Pacific Symposium
実装技術における封止技術の動向 (特設記事 実装分野の注目技術)
1997
·
隆治 島田
, Jim Klocke
, et al.
·
電子材料
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Works count:
24
Citation count:
36
H-index:
4
I10-index:
1
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