Get started
Author

C.-P Hung

Observed names: C P Hung, C. P. Hung, C.-P. Hung, C.P. Hung, C.p. Hung, CP Hung, Chih Pin Hung, Cp Hung
ORCID: 0000-0001-9023-3999
Observed ORCID: 0000-0001-9023-3999
OpenAlex ID: A5025632983
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
2016 · Chang-Chi Lee, Cp Hung, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 148
A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
2020 · Wei-Hong Lai, Penny Yang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 46
FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages
2021 · Mengkai Shih, Karen Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 42
Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
2019 · Mengkai Shih, Chih-Yi Huang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 36
Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages
2022 · Meng-Kai Shih, Weihong Lai, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 32
Mechanical and Thermal Characterization Analysis of Chip-last Fan-out Chip on Substrate
2022 · Wei-Jie Yin, Wei-Hong Lai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26
Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration
2022 · Jen-Hsien Wong, NanYi Wu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
Warpage Characterization of Glass Interposer Package Development
2017 · Meng-Kai Shih, Charles Hsu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules
2022 · Meng-Kai Shih, Nan-Yi Wu, et al. · IEEE Transactions on Electron Devices · 16
Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions
2023 · Meng-Kai Shih, Yu-Hao Liu, et al. · Materials · 14
PDF
Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs
2002 · T.S. Horng, S.M. Wu, et al. · Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium · 14
Thermal Characteristics Analysis and Optimization of Heterogeneous 2.5-D Package Under System-Level Conditions
2024 · Meng-Kai Shih, Tang-Yuan Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 12
Solder joint reliability analysis for large size WLCSP
2017 · Meng-Kai Shih, Hsin-Chih Shih, et al. · International Conference on Electronics Packaging (ICEP) · 12
Super broadband lumped models for embedded passives
2004 · C.T. Chiu, T.S. Horng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Development of high-Q embedded passive library for RF-SOP module applications
2005 · T.S. Horng, Y.S. Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Packaging effects on a CMOS low-noise amplifier: Flip-chip versus wirebond
2009 · K.-C. Lu, F.-Y. Han, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard small outline packages
2002 · T.S. Horng, S.M. Wu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Design for Void Free Transfer Molding SiP
2020 · Bing-Yuan Huang, Ian Hu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 8
High Power Large Size HFCBGA Thermal Characterization
2019 · Ian Hu, Jung-Che Tsai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 8
Mechanical Reliability Analysis of Dual Side Molding SiP Module
2021 · Tse-Wei Liao, Wei-Hong Lai, et al. · International Conference on Electronics Packaging (ICEP) · 7
Parameters study of thermomechanical reliability of board-level fan-out package
2017 · Meng-Kai Shih, Ying-Chih Lee, et al. · International Conference on Electronics Packaging (ICEP) · 7
Thermal-moisture coupling effects on PA and UF warpage stress of 2.5D IC package by FE simulation analysis
2014 · M. H. Wang, C. T. Wang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 7
Design and modeling of planar transformer-based integrated passive devices for wireless applications
2009 · C.-H. Huang, T.-C. Wei, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Design of Super-Miniature Bandpass Filters Embedded in the Organic Substrate without Using Large-Value Capacitors
2006 · C.T. Chiu, C.L. Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages
2018 · Meng-Kai Shih, Eddie Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Works count: 64
Citation count: 602
H-index: 12
I10-index: 15
Year
Topic
Type