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Akihiro Shimizu

Observed name: A. Shimizu
Observed institutions: Ushio (Japan), Gifu University
ORCID: 0000-0003-3269-5903
Observed ORCID: 0000-0003-3269-5903
OpenAlex ID: A5025868058
Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer
2024 · Akihiro Shimizu, Kazuhiro Fukada, et al. · Japanese Journal of Applied Physics · 16
Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2024 · S. Endo, A. Shimizu, et al. · ECS Journal of Solid State Science and Technology · 11
Evaluation of the High-Frequency Transmission Characteristics of Coplanar Transmission Lines Fabricated on a Copper-Plated Cycloolefin Polymer Using a Direct Sputtering Copper Seed Layer
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IEEE Access · 8
Enhanced Adhesion of Direct Sputtered Copper Seed Layer on Cycloolefin Polymer through Vacuum Ultraviolet Irradiation and Oxygen Plasma Treatment
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · ECS Journal of Solid State Science and Technology · 4
Analysis of the adhesion structure between the cycloolefin polymer and the copper seed layer formed using medium-vacuum sputtering
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 4
Study of Color Change Characteristics of Plasma Indicators by Vacuum Ultraviolet Light from Excimer Lamps
2023 · Akihiro Shimizu, Shinichi Endo, et al. · Transactions of The Japan Institute of Electronics Packaging · 3
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A Mild Surface Activation Under Redox Gases Using Vacuum Ultraviolet Irradiation for Interconnection of Semiconductor Packaging
2025 · Shinichi Endo, Akihiro Shimizu · IEEE Electronic Components and Technology Conference (ECTC) · 2
Activation of Copper Surfaces by VUV - Redox Method Using a Xenon Excimer Lamp
2024 · Shinichi Endo, Akihiro Shimizu · IEEE International D Systems Integration Conference · 2
Quantitative assessment of surface degradation in cycloolefin polymer films subjected to vacuum ultraviolet irradiation and oxygen plasma treatment using a micro slurry-jet erosion test
2025 · Akihiro Shimizu, Tohru Matsubara, et al. · Journal of Adhesion Science and Technology · 1
Depth-resolved characterization of mechanically weakened surface layers in vacuum ultraviolet-irradiated cycloolefin polymer films using micro slurry-jet erosion test and ToF-SIMS analysis
2025 · Akihiro Shimizu, Kazuya Okada, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 1
Dose-dependent evolution of weakened boundary layers on cycloolefin polymer surfaces under vacuum ultraviolet irradiation
2026 · Akihiro Shimizu · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena
P‐11: Distinguished Poster Paper: High‐Mobility Indium Gallium Oxide TFTs Fabricated from an Aqueous Precursor with Excimer‐Light Activation
2026 · Kazuki Ueda, Ryosuke Kasahara, et al. · SID Symposium Digest of Technical Papers
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An Evaluation of Hybrid Bonding of Cu/SiO 2 using Vacuum Ultraviolet Light under Redox Gases
2026 · Shinichi Endo, Wu Kejun, et al. · IEEE Electronic Components and Technology Conference (ECTC)
High‐Mobility Indium Gallium Oxide TFTs Fabricated From an Aqueous Precursor With Excimer‐Light Activation
2026 · Kazuki Ueda, Hideya Ochiai, et al. · Journal of the Society for Information Display
Atmospheric Pressure Plasma Treatment for Direct Sputtering of Copper Seed Layers on Cycloolefin Polymer Films for High‐Frequency Applications
2026 · Akihiro Shimizu, Shinichi Endo, et al. · Plasma Processes and Polymers
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Fabrication and Characterization of Top-Gate In-Ga-O Thin-Film Transistors Using Aqueous Precursor Solutions and Excimer Light Irradiation
2025 · Hideya Ochiai, Kazuki Ueda, et al. · Proceedings of the International Display Workshops
Adhesion Characteristics of Directly Sputtered Copper Seed Layer on Cycloolefin Polymer with Atmospheric Pressure Plasma Treatment
2025 · A. Shimizu, S. Endo · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Comparison of High-Frequency Transmission Characteristics of Transmission Lines on Copper-Plated Cycloolefin Polymer Using Directly Sputtered Copper Seed Layer and Electroless Copper Plating Seed Layer
2025 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IMAPSource Proceedings
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Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission Loss
2024 · Akihiro Shimizu, Kazuhiro Fukada, et al. · IEEE International D Systems Integration Conference
Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2023 · Shinichi Endo, Akihiro Shimizu, et al. · ECS Meeting Abstracts
Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
2023 · Shinichi Endo, Akihiro Shimizu, et al. · ECS Transactions
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Color Change Characteristics of Plasma Indicators by Vacuum Ultraviolet Irradiation
2022 · Akihiro Shimizu, Shinichi Endo, et al. · International Conference on Electronics Packaging (ICEP)
Works count: 22
Citation count: 52
H-index: 4
I10-index: 2
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