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Tomohito Iwashige

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
2017 · Chuantong Chen, Shijo Nagao, et al. · Acta Materialia · 119
High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates
2017 · Chuantong Chen, Katsuaki Suganuma, et al. · Journal of Materials Science Materials in Electronics · 113
Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
2016 · Chuantong Chen, Shijo Nagao, et al. · Journal of Electronic Materials · 100
Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure
2019 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 79
Self-healing of cracks in Ag joining layer for die-attachment in power devices
2016 · Chuantong Chen, Shijo Nagao, et al. · Applied Physics Letters · 47
Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles
2019 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · Applied Physics Letters · 26
Dielectric Relaxation of Polymer/Carbon Dioxide Systems
2009 · Yumi Matsumiya, Tadashi Inoue, et al. · Macromolecules · 19
Prominent interface structure and bonding material of power module for high temperature operation
2017 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 11
Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection
2016 · Chuantong Chen, Shijo Nagao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins
2019 · Tomohito Iwashige, Takeshi Endo, et al. · Journal of Materials Science Materials in Electronics · 9
First failure point of a SiC power module with sintered Ag die-attach on reliability tests
2017 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · International Conference on Electronics Packaging (ICEP) · 9
Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test
2017 · Chuantong Chen, Shijo Nagao, et al. · International Conference on Electronics Packaging (ICEP) · 7
Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
2019 · Tomohito Iwashige, Takeshi Endo, et al. · Journal of Materials Science · 5
Synthesis and Catalytic Performance of Organic–Inorganic Hybrid Mesoporous Material Having Basic Nanospace
2010 · Tetsuya Shishido, Toru Kawaguchi, et al. · Catalysis Letters · 5
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In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature
2019 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · Japanese Journal of Applied Physics · 3
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Effect of annealing Co-W-P metallization substrate onto its resin adhesion
2019 · Tomohito Iwashige, Takeshi Endo, et al. · Journal of Materials Science Materials in Electronics · 1
Metallization technology of SiC power module in high temperature operation
2018 · Tomohito Iwashige, Kazuhiko Sugiura, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 1
Metallization Technology for High Current Density and High Temperature Operation Power Modules
2019 · K. Sugiura, T. Iwashige, et al. · International Conference on Solid State Devices and Materials (SSDM)
Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag
2018 · Chuantong Chen, Zheng Zhang, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Works count: 19
Citation count: 565
H-index: 9
I10-index: 9
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