Author

Phillip E. Tuma

Observed names: P.E. Tuma, Phil E. Tuma, Philip E. Tuma, Phillip Tuma
Institution: 3M (United States)
Observed institution: 3M (United States)
ORCID: 0000-0002-7777-179X
Observed ORCID: 0000-0002-7777-179X
OpenAlex ID: A5029272606
2010 · Phillip E. Tuma · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 99
2010 · Cindy M. Barnes, Phillip E. Tuma · IEEE Transactions on Power Electronics · 61
2021 · Majid Jalili, Ioannis Manousakis, et al. · Proceedings - International Symposium on Computer Architecture/Proceedings · 58
2008 · Phillip E. Tuma · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 37
2006 · P.E. Tuma · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 29
2011 · Phillip E. Tuma · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 28
2012 · Levi Campbell, Phillip Tuma · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 17
2022 · Pulkit A. Misra, Ioannis Manousakis, et al. · IEEE Micro · 12
2009 · C.M. Barnes, P.E. Tuma · IEEE Vehicle Power and Propulsion Conference (VPPC) · 12
2007 · Phillip E. Tuma, Bamidele O. Fayemi, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 10
2023 · Jimil M. Shah, Thomas Crandall, et al. · Journal of Electronic Packaging · 8
2008 · Cindy M. Barnes, Phil E. Tuma · ASME Heat Transfer Summer Conference (HT) · 7
2020 · Huseyin Bostanci, Mohammed Awaizulla Shareef, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 4
2022 · Jimil M. Shah, Phillip E. Tuma · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
Works count: 15
Citation count: 384
H-index: 10
I10-index: 10
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