Author

Neven Orhanovic

Observed name: N. Orhanovic

Observed institutions: Oregon State University, University of Zagreb, Mentor Graphics (United States)

OpenAlex ID: A5031361650

Time domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics

2002 · N. Orhanovic, V.K. Tripathi, et al. · IEEE MTT-S International Microwave Symposium digest · 34

Generalized method of characteristics for time domain simulation of multiconductor lossy transmission lines

2002 · N. Orhanovic, V.K. Tripathi, et al. · IEEE International Symposium on Circuits and Systems proceedings · 26

Full wave analysis of planar interconnect structures using FDTD-SPICE

2002 · N. Orhanovic, R. Raghuram, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 22

Time-domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics

1993 · N. Orhanovic, P. Wang, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 16

Time-domain characterization and analysis of dispersive dissipative interconnects

1992 · V.K. Tripathi, N. Orhanovic · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 13

Signal propagation and radiation of single and differential microstrip traces over split image planes

2002 · N. Orhanovic, R. Raghuram, et al. · IEEE International Symposium on Electromagnetic Compatibility · 12

Characterization of microstrip meanders in PCB interconnects

2002 · N. Orhanovic, R. Raghuram, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

FDTD/spl I.bar/SPICE analysis of EMI and SSO of LSI ICs using a full chip macro model

2003 · N. Matsui, N. Orhanovic, et al. · IEEE International Symposium on Electromagnetic Compatibility · 8

Nonlinear transient analysis of coupled RLGC lines by the method of characteristics

1992 · N. Orhanovic, V. K. Tripathi · International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering · 8

Structure decomposition for hybrid analysis of multilayer interconnect systems

2003 · N. Orhanovic, D. Divekar, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 7

FDTD-SPICE analysis of high-speed cells in silicon integrated circuits

2003 · N. Orhanovic, N. Matsui · IEEE Electronic Components and Technology Conference (ECTC) · 7

Nonlinear Full Wave Time Domain Solutions using FDTD_SPICE for High Speed Digital and RF

2001 · N. Orhanovic, Raj Raghuram, et al. · 7

Return path analyzer based on PEEC and sectioning methods

2002 · N. Matsui, S. Shintani, et al. · IEEE International Symposium on Electromagnetic Compatibility · 6

Coupled line multiports

2003 · V.K. Tripathi, Y.K. Chin, et al. · IEEE International Symposium on Circuits and Systems proceedings · 5

Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits

1991 · Neven Orhanovic, Leonard A. Hayden, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

Compact 2D FDFD based full wave method for the extraction of RLGC parameters of general guided wave structures

2005 · N. Orhanovic, D. Divekar, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 4

FDTD_SPICE Analysis of EMI and SSO of LSI ICs Using a Full Chip Macro Model

2002 · N. Matsui, N. Orhanovic, et al. · 4

Chip complexity requires signal and power integrity

2006 · Norio Matsui, Dileep Divekar, et al. · IEEE Potentials · 2

Time domain characterization of dispersive dissipative interconnects

2005 · V.K. Tripathi, N. Orhanovic · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 1

Full Chip Signal and Power Integrity with Silicon Substrate Effect

2004 · N. Matsui, D. Divekar, et al. · 1

SI and EMI analysis of analog circuit board combination of PEEC and MOR

2004 · N. Matsui, D. Divekar, et al.

Degradation factors for eye diagrams using FDTD/SPICE

2004 · N. Orhanovic, D. Divekar, et al. · IEEE Electronic Components and Technology Conference (ECTC)

Transient analysis of dissipative dispersive multiconductor transmission lines by the extended method of characteristics

2003 · N. Orhanovic, V.K. Tripathi · IEEE International Symposium on Circuits and Systems proceedings

Decomposition of Coplanar and Multilayer Interconnect Structures with Split Power Distribution Planes for Hybrid Circuit-Field Analysis

2003 · N. Orhanovic, D. Divekar, et al.

Time domain simulation of three dimensional microwave structures by the method of characteristics

2002 · N. Orhanovic, V.K. Tripathi · IEEE MTT-S International Microwave Symposium digest

Works count: 30

Citation count: 197

H-index: 8

I10-index: 6