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Carl Chen
Institution:
Siliconware Precision Industries (Taiwan)
Observed institution:
Siliconware Precision Industries (Taiwan)
OpenAlex ID:
A5034531171
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
2011
·
Aibin Yu
, John H. Lau
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
67
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
2009
·
Aibin Yu
, John H. Lau
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
52
Flux study for ultra fine pitch flip chip packages
2009
·
Wen-Hao Lee
, G. T. Lin
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
11
High hermetic performance of glass frit for MEMS package
2010
·
Hong-da Chang
, Chun-An Huang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
9
The warpage and stress simulation study of embedded organic substrate
2010
·
David Chang
, Hs Hsu
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking
2009
·
Chee Houe Khong
, Aibin Yu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
On-wafer probing measurement and simulation modeling correlation of spiral inductors for integrative passive device application
2010
·
Ming-Fan Tsai
, Boxiang Fang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Package characterization on advanced NBA-QFN structure
2010
·
Vito Lin
, Eason Chen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Film type solder mask evaluation for flip chip BGA
2009
·
Chun Hsien Fu
, David Chang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package
2024
·
Wen-Yu Teng
, Liang-Yih Hung
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Enhancing Adhesion and Peel Strength for Fine Line Design on FCCSP Package
2024
·
Rick Yeh
, MJ He
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
1
Study of Solder Resist Undercut for Flip Chip Chip Scale Package Substrate
2024
·
Ming Yu Chiang
, Yu-Po Wang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Advanced TIM Material Analysis for High Performance Package Applications
2024
·
Jyun-De Jhan
, Wen-Yu Teng
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate
2023
·
Yuan-Chang Ni
, Wen-Yu Teng
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
1
Common Neck Problems
2017
·
Carl Chen
·
Elsevier eBooks
·
1
A study of thin wafer handling in 3D-IC applications
2010
·
Chien-Feng Chan
, Jeng-Yu Feng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Three dimensional interconnects with through silicon vias and electroplating solder microbumps
2010
·
Genie Tsai
, Scott Chen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Investigation of Blind MicroVias Bonding Force: A Field Study
2024
·
Hung-Kun Chen
, Shun-Jen Chan
, et al.
·
International Conference on Electronics Packaging (ICEP)
High Thermal EMC Solution Applied in Thin FCCSP
2023
·
Pin-Jing Su
, Jerry Wang
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
EMI improvement study on advanced package design
2010
·
Robert Sung
, Kevin Chiang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Works count:
20
Citation count:
167
H-index:
5
I10-index:
3
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