Get started
Author

Yuping Le

Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
2021 · Fuliang Wang, Yuping Le · Scientific Reports · 28
PDF
Effect of molecular weight and concentration of polyethylene glycol on through‑silicon via filling by copper
2019 · Fuliang Wang, Kang Zhou, et al. · Microelectronic Engineering · 25
Novel blue luminescent materials for organic light-emitting diodes based on C9-fluorenyl anthracenes
2012 · Wen Wan, Heliang Du, et al. · Dyes and Pigments · 22
Enhanced Antimicrobial Activity of AgCu Nanoparticles: The Role of Particle Size and Alloy Composition
2024 · Yuping Le, Fang Zhou, et al. · Molecules · 19
Bis-(3-sulfopropyl) Disulfide Acceleration of Copper Electrodeposition via Molecular Dynamics and Quantum Chemical Calculations
2020 · Fuliang Wang, Yuping Le · International Journal of Electrochemical Science · 15
Effect of cetyl-trimethyl-ammonium-bromide (CTAB) and bis (3-sulfopropyl) disulfide (SPS) on the through-silicon-via (TSV) copper filling
2019 · Fuliang Wang, Qinglong Zhang, et al. · Microelectronic Engineering · 13
Studies of fluorine auxochrome in C9-fluorenyl anthracenes on optoelectronic property for blue electroluminescent materials
2018 · Guobin Ma, Huaxin Zhao, et al. · Dyes and Pigments · 11
Robust and repairable PET superwicking surfaces: A simple two-step fabrication approach for enhanced liquid transport
2024 · Yuping Le, Longlai Yang, et al. · Surfaces and Interfaces · 5
Void Free TSV Copper Filling using Single Additive 3-(1-Pyridinio)-1-Propanesulfonate (PPS)
2020 · Yuping Le, Fuliang Wang · International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE) · 5
Effect of aliphatic-amine ethoxy sulfonates (AESS) on micro copper columns fabrication by using localized electrochemical deposition
2019 · Fuliang Wang, Yufei Xiao, et al. · Materials Research Express · 5
Molecular dynamics simulations combined with experimental investigations of Cu@Ag core-shell nanoparticles and their applications in electronic pastes
2025 · Tingxu Gao, Yuping Le, et al. · Materials Today Communications · 3
TSV Filling with Copper Electro-deposition by Using Sodium 3-[[(dimethylamino) thioxomethyl] thio] Propane Sulphonate
2023 · Yuping Le · Journal of Physics Conference Series · 1
PDF
Molecular insight into the adsorption of imidazole derivatives on copper surfaces: From local bonding to global synergistic effects
2026 · Junfeng Li, Fengfeng Qin, et al. · Journal of Physics Conference Series
PDF
Decoupling interface and thickness effects on hydrogen absorption in V/MgO: experiments and DFT
2026 · Qiuxiang Zhang, Yan Zhu, et al. · Physica Scripta
PDF
Molecular dynamics study on the enhancement of phenolic resin properties by silica
2026 · Wangcun Ji, Xia Cai, et al. · Journal of Physics Conference Series
Ag-Decorated CuZn Nanocomposites with Regulated Multi-Ion Release for Low-Silver Antibacterial Applications
2026 · Li Wan, Juan Luo, et al. · SSRN Electronic Journal
Halide-Controlled Copper Electrodeposition for TSV Filling: Linking Cuprous Halide Interfacial Configurations to Electrochemical Kinetics
2026 · Yuping Le, Xiaofang Peng, et al. · SSRN Electronic Journal
PDF
Corrigendum to ‘Molecular dynamics simulations combined with experimental investigations of Cu@Ag core-shell nanoparticles and their applications in electronic pastes’ [Mater. Today Commun. 44 (2025) 112196]
2025 · Tingxu Gao, Yuping Le, et al. · Materials Today Communications
TSV filling with copper electro-deposition by using phenyl disulfide propane sodium
2023 · Yuping Le · International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE)
CCDC 859994: Experimental Crystal Structure Determination
2014 · Wan, Wen, Du, Heliang, et al. · The Cambridge Structural Database
Works count: 20
Citation count: 152
H-index: 7
I10-index: 7
Year
Topic
Type