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Author

Astrid Gollhardt

Observed names: A Gollhardt, A. Gollhardt, Gollhardt, A.
ORCID: 0000-0001-5293-5498
Observed ORCID: 0000-0001-5293-5498
OpenAlex ID: A5037221739
Reliability assessment of flip-chip assemblies with lead-free solder joints
2002 · A. Schubert, R. Dudek, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 77
Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
2006 · N Sabaté, D Vogel, et al. · Nanotechnology · 64
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Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution
2007 · Neus Sabate, Dietmar Vogel, et al. · Journal of Microelectromechanical Systems · 63
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Measurement of residual stress by slot milling with focused ion-beam equipment
2006 · N Sabaté, D Vogel, et al. · Journal of Micromechanics and Microengineering · 58
Measurement of residual stresses in micromachined structures in a microregion
2006 · N. Sabaté, D. Vogel, et al. · Applied Physics Letters · 50
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FIB-based technique for stress characterization on thin films for reliability purposes
2007 · N. Sabaté, D. Vogel, et al. · Microelectronic Engineering · 40
Micro- and nanomaterials characterization by image correlation methods
2002 · D. Vogel, A. Gollhardt, et al. · Sensors and Actuators A Physical · 24
Catastrophic Optical Damage in Semiconductor Lasers: Physics and New Results on InGaN High‐Power Diode Lasers
2021 · Martin Hempel, Shabnam Dadgostar, et al. · physica status solidi (RRL) - Rapid Research Letters · 19
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Localized Stress Measurements - A New Approach Covering Needs for Advanced Micro and Nanoscale System Development
2007 · Dietmar Vogel, Astrid Gollhardt, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
Characterization of Thermal Interface Materials to Support Thermal Simulation
2007 · Schacht, R., May, D., et al. · arXiv (Cornell University) · 16
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An In Vivo Biostability Evaluation of ALD and Parylene‐ALD Multilayers as Micro‐Packaging Solutions for Small Single‐Chip Implants
2025 · Kambiz Nanbakhsh, Matthias Van Gompel, et al. · Small · 10
Evaluating microdefect structures by AFM-based deformation measurement
2003 · Dietmar Vogel, Juergen Keller, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10
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FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation
2006 · J. Keller, A. Gollhardt, et al. · Materials science forum · 9
Corrosion behaviour of sintered silver under maritime environmental conditions
2018 · E. Kolbinger, S. Wagner, et al. · Microelectronics Reliability · 8
Failure modeling of ACA-glued flip-chip on flex assemblies
2008 · B. Wunderle, C. Kallmayer, et al. · Microsystem Technologies · 7
Characterization of Thermal Interface Materials
2006 · Ralph Schacht, Daniel May, et al. · Electronic System-Integration Technology Conference (ESTC) · 7
FIB based measurements for material characterization on MEMS structures
2005 · Dietmar Vogel, Daniel Lieske, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Thermo-mechanical reliability of lead-free solder interconnects
2002 · A. Schubert, R. Dudek, et al. · International Symposium on Advanced Packaging Materials · 7
Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
2011 · Dietmar Vogel, Sven Rzepka, et al. · International Semiconductor Conference Dresden-Grenoble (ISCDG) · 6
Displacement and strain field measurements for nanotechnology applications
2002 · D. Vogel, J. Keller, et al. · IEEE Conference on Nanotechnology (IEEE NANO) · 6
Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-Pitch Cu RDL
2024 · Adrija Chaudhuri, Johannes Jaeschke, et al. · Electronic System-Integration Technology Conference (ESTC) · 4
Nanoscale deformation measurements for reliability analysis of sensors
2005 · Juergen Keller, Astrid Gollhardt, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Non-monolithic fabrication of thin-film microelectrode arrays on PMUT transducers as a bimodal neuroscientific investigation tool*
2023 · Andrada I. Velea, Joshua Wilson, et al. · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · 3
Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method
2020 · Markus Woehrmann, Aleksander Keller, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
FIB-based measurement of local residual stresses on microsystems
2006 · Dietmar Vogel, Neus Sabate, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Works count: 77
Citation count: 556
H-index: 10
I10-index: 12
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