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Binhao Lian

Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration
2015 · P.R. Lin, G.Q. Zhang, et al. · Microelectronic Engineering · 20
Electrical simulation of gold bonding wire with different parameters
2015 · Dejing Wang, Yuanfu Zhao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 15
Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders
2025 · Xiaochen Xie, Pengrong Lin, et al. · Materials · 12
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A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
2018 · Pengrong Lin, Xiaochen Xie, et al. · Microsystem Technologies · 11
Effect of temperature cycling on reliability of flip chip solder joint
2014 · Xueming Jiang, Pengrong Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7
The Study for Thermal Analysis Technology of Three-Dimension SRAM Component
2007 · Yusheng Cao, Tong Jiang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 6
The influence of the solder joint void on the CCGA package reliability
2014 · Yingzhuo Huang, Binhao Lian, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Reliability study of the solder joints in CCGA package during thermal test
2014 · Xiaorui Lv, Yingzhuo Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Simulation of bonding wire deformation in random vibration
2013 · Peifeng Hu, Yusheng Cao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
The Study for Thermal Analysis Technology of Three-Dimension SRAM Component
2007 · Yusheng Cao, Tong Jiang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Study on the electrical performance of Au bump in FC ceramic package
2017 · Feng Lu, Peifeng Hu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
The reliability of high-lead solder joints in flip-chip devices
2014 · Lingjuan Tian, Yuanfu Zhao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Research of surface wettability of plating on the ceramic shell
2014 · Dongmei Li, Xiaocheng Feng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Study on the electrical performance of one differential pair bonding fingers on different layers in wire bonding package
2016 · Feng Lu, Yusheng Cao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
The finite element analysis on reliability of gold bump
2016 · Jiansong Liu, Quanbin Yao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Study on Electrical Performance of FC and WB in IC Ceramic Package
2016 · Dejing Wang, Yuanfu Zhao, et al. · International Conference on Materials Engineering, Manufacturing Technology and Control (ICMEMTC) · 1
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Design and simulation of CCGA AlN ceramic package
2015 · Feng Lu, Zhijie Deng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Effect of Cu on interfacial reaction in high-lead solder bumps
2015 · Liwei Xu, Mingliang Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
The study on grinding process of flip chip wafers
2013 · Xiaobo Zhuang, Binhao Lian, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
The Mechanical Analysis of Sn-Base Bump
2019 · Jun Yang, Quanbin Yao, et al. · IOP Conference Series Materials Science and Engineering
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Researchon Mechanical Behavior of Through silicon via of 2.5D Interposer
2018 · Jun Yang, Quanbin Yao, et al. · International Conference on Electronic Packaging Technology (ICEPT)
The effects of Au film thickness on the reliability of Sn-Pb solder joints
2015 · Xiaorui Lv, Pengrong Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Research on the impact of heat treatment on coating quality and reliability of welding after plating nickel
2015 · Dongmei Li, Jinchun He, et al. · International Conference on Electronic Packaging Technology (ICEPT)
The reliability of high-lead solder joints in flip-chip devices
2014 · Lingjuan Tian, Yuanfu Zhao, et al. · IEEE International Symposium on Applications of Ferroelectrics (ISAF)
Research of surface wettability of plating on the ceramic shell
2014 · Dongmei Li, Xiaocheng Feng, et al. · IEEE International Symposium on Applications of Ferroelectrics (ISAF)
Works count: 31
Citation count: 99
H-index: 6
I10-index: 4
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