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Author

Dameng Li

Observed name: Dejian Li
OpenAlex ID: A5038281170
Pneumatic Noise Study of Multi-Stage Sleeve Control Valve
2023 · Jianbo Jia, Yan Shi, et al. · Processes · 11
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Research on Fault Diagnosis of Analog Circuit Based on Volterra Theory and Higher-Order Spectrum Analysis
2020 · Kun Wang, Yuan Guan, et al. · IOP Conference Series Materials Science and Engineering · 6
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High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere
2025 · Bofu Li, Yinyin Luo, et al. · Processes · 5
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging
2025 · Dejian Li, Bofu Li, et al. · Micromachines · 4
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Vertical Thermal Design and Modeling for Integrated Power Amplifier WBLGA SiP Packaging
2024 · Bofu Li, DeJian Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Testing and trimming methods of high-resolution and large swing for ADC based on ATE
2021 · Liran Li, Pengcheng Xiao, et al. · IEEE International Conference on ASIC (ASICON) · 3
Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules
2021 · Qi Zheng, Huimin He, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Effect of Chip Package Interaction on Cu/Ultralow-k Interconnect Fracture in Flip Chips
2024 · Bofu Li, Dameng Li, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Optimization of Package Heat Dissipation Design Based on High-power WB-BGA Industrial Chip with a Wide Temperature Range
2023 · Shihua Duan, Dejian Li, et al. · Journal of Physics Conference Series · 1
Formation mechanisms of large-scale ancient landslides in the Meigu River basin, eastern margin of Tibetan plateau
2025 · Zhiqiang Yin, Liang Chen, et al. · Quaternary International
A 16-32GHz 82-fsrms Fractional-N Sampling PLL with Dual-Core Quad-Mode VCO in 28-nm CMOS
2025 · Ruichang Ma, Huanyu Ge, et al. · IEEE Asian Solid-State Circuits Conference (A-SSCC)
Design and flow field characterization of safety valves based on the Laval principle
2025 · Lisong Wang, Zhuozhuo Qin, et al. · Mechanics & Industry
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A High-Resolution Large Swing Signal Generation Test Method for ADC Automatic Testing
2024 · Bofu Li, Dameng Li, et al. · International Conference on Electronic Technology and Information Science (ICETIS)
Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package
2022 · Shunfeng Han, Dejian Li, et al. · International Conference on Electronic Packaging Technology (ICEPT)
The multi-dimension co-design for the package of the high-speed multi-function chip
2021 · Yuan Guan, Yubo Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Works count: 15
Citation count: 37
H-index: 4
I10-index: 1
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