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Masaru Bunya

Observed names: M. Bunya, Masaru BUNYA
OpenAlex ID: A5040392273
Application of MCD Spectroscopy and TD‐DFT to Nonplanar Core‐Modified Tetrabenzoporphyrins: Effect of Reduced Symmetry on Nonplanar Porphyrinoids
2008 · John Mack, Masaru Bunya, et al. · Chemistry - A European Journal · 60
Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition
2012 · M. Takeuchi, K. Kondo, et al. · Journal of The Electrochemical Society · 31
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Applications of copolymer for rapid identification of bacteria in blood culture broths using matrix-assisted laser desorption ionization time-of-flight mass spectrometry
2017 · Kazuho Ashizawa, Syota Murata, et al. · Journal of Microbiological Methods · 28
Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform
2013 · Taro Hayashi, Kazuo Kondo, et al. · Journal of The Electrochemical Society · 17
Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition
2013 · M. Takeuchi, Y. Yamada, et al. · Journal of The Electrochemical Society · 9
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Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition
2014 · Yasutaka Yamada, Kazuo Kondo, et al. · ECS Transactions · 4
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Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition
2014 · Minoru TAKEUCHI, Yoshihiro ANAMI, et al. · Electrochemistry · 2
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(Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV)
2012 · Taro Hayashi, Kazuo Kondo, et al. · ECS Transactions · 2
The Effects of Diallylamine Compounds on Copper Via Fill Plating
2015 · Yasutaka Yamada, Minoru Takeuchi, et al. · Journal of The Japan Institute of Electronics Packaging
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Diallylamine Levelers Side Chains Effect On Copper Via Filling
2013 · Yasutaka Yamada, Kazuo Kondo, et al. · ECS Meeting Abstracts
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Small diameter via filling electrodeposition by periodical reverse current
2013 · Taro Hayashi, Kazuo Kondo, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Via Filling Electrodeposotion of 4μm Diameter Via by Periodical Reverse Current
2013 · Taro Hayashi, K. Kondo, et al. · ECS Transactions
Via Filling Electrodeposotion of 4μm Diameter via by Periodical Reverse Current
2012 · Taro Hayashi, K. Kondo, et al. · ECS Meeting Abstracts
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Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm
2012 · Minoru Takeuchi, Kazuo Kondo, et al. · ECS Transactions
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3D interconnected technology by high speed copper electrodeposition using diallylamine levelers
2012 · Taro Hayashi, Kazuo Kondo, et al. · IEEE International D Systems Integration Conference
High Speed Copper Electrodeposition for through Silicon Via(TSV)
2011 · Taro Hayashi, Kazuo Kondo, et al. · ECS Meeting Abstracts
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Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm
2011 · Kazuo Kondo, Minoru Takeuchi, et al. · ECS Meeting Abstracts
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Copper Filling using Diallylamine Additives
2011 · Yoshihiro ANAMI, Minoru TAKEUCHI, et al. · Journal of The Surface Finishing Society of Japan
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Works count: 18
Citation count: 153
H-index: 5
I10-index: 4
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