Author

Siddhartha Sinha

Observed name: S. Sinha

Institution: IMEC

Observed institutions: Raman Research Institute, The University of Western Australia, Ferdinand-Braun-Institut, IMEC, Indian Institute of Science Bangalore, Technical University of Munich

ORCID: 0000-0003-4025-2854

Observed ORCID: 0000-0003-4025-2854

OpenAlex ID: A5041140995

Higher signal harmonics, LISA’s angular resolution, and dark energy

2007 · K. G. Arun, Bala R. Iyer, et al. · Physical review. D. Particles, fields, gravitation, and cosmology/Physical review. D. Particles and fields · 137

A 28-nm-CMOS Based 145-GHz FMCW Radar: System, Circuits, and Characterization

2021 · Akshay Visweswaran, Kristof Vaesen, et al. · IEEE Journal of Solid-State Circuits · 103

9.4 A 145GHz FMCW-Radar Transceiver in 28nm CMOS

2019 · Akshay Visweswaran, Kristof Vaesen, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 79

A D-Band Low-Power and High-Efficiency Frequency Multiply-by-9 FMCW Radar Transmitter in 28-nm CMOS

2022 · Sehoon Park, Dae-Woong Park, et al. · IEEE Journal of Solid-State Circuits · 60

Higher harmonics increase LISA’s mass reach for supermassive black holes

2007 · K. G. Arun, Bala R. Iyer, et al. · Physical review. D. Particles, fields, gravitation, and cosmology/Physical review. D. Particles and fields · 55

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Connecting Chips With More Than 100 GHz Bandwidth

2021 · Wolfgang Heinrich, Maruf Hossain, et al. · IEEE Journal of Microwaves · 51

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Miniaturized (127 to 154) GHz Dipole Arrays in 28 nm Bulk CMOS With Enhanced Efficiency

2020 · Siddhartha Sinha, Michael Libois, et al. · IEEE Transactions on Antennas and Propagation · 35

A 67-mW D -Band FMCW I/Q Radar Receiver With an N -Path Spillover Notch Filter in 28-nm CMOS

2022 · Anirudh Kankuppe, Sehoon Park, et al. · IEEE Journal of Solid-State Circuits · 34

Flip-Chip Interconnects for 250 GHz Modules

2015 · Sirinpa Monayakul, S. Sinha, et al. · IEEE Microwave and Wireless Components Letters · 34

Flip-Chip Approach for 500 GHz Broadband Interconnects

2017 · Siddhartha Sinha, Ralf Doerner, et al. · IEEE Transactions on Microwave Theory and Techniques · 31

Quantum computing algorithm for electromagnetic field simulation

2009 · Siddhartha Sinha, Peter Russer · Quantum Information Processing · 28

Challenges and Opportunities in D-Band Transmitter Architectures and Antenna Design, Integration, and Scalability for 6G Communications: A Brief Review

2025 · Shah Zaib Aslam, Alexander Wilcher, et al. · IEEE Access · 22

Publisher’s Note: Higher signal harmonics, LISA’s angular resolution, and dark energy [Phys. Rev. D76, 104016 (2007)]

2007 · K. G. Arun, Bala R. Iyer, et al. · Physical review. D. Particles, fields, gravitation, and cosmology/Physical review. D. Particles and fields · 21

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Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

2017 · Nils G. Weimann, Sirinpa Monayakul, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 20

InP / CMOS co-integration for energy efficient sub-THz communication systems

2021 · Claude Desset, Nadine Collaert, et al. · IEEE Globecom Workshops (GC Wkshps) · 19

D -Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs

2023 · Siddhartha Sinha, Heinrich Trischler, et al. · IEEE Microwave and Wireless Technology Letters · 18

III-V/III-N technologies for next generation high-capacity wireless communication

2022 · N. Collaert, A. Alian, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 18

A 62mW 60GHz FMCW Radar in 28nm CMOS

2020 · Sehoon Park, Anirudh Kankuppe, et al. · Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium · 17

A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process

2020 · S. Sinha, S Hung, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 16

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

2022 · X. Sun, J. Slabbekoorn, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13

Shared Aperture Dual-Wideband Planar Antenna Arrays Using Any-Layer PCB Technology for mm-Wave Applications

2021 · M. Roodaki-Lavasani-Fard, S. Sinha, et al. · IEEE Transactions on Antennas and Propagation · 13

(Why do we need) Wireless Heterogeneous Integration (anyway?)

2022 · M. Peeters, S. Sinha, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 11

Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

2023 · Laura Van Messem, Siddhartha Sinha, et al. · Scientific Reports · 10

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Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

2013 · J. Böck, M. Wojnowski, et al. · International Journal of Microwave and Wireless Technologies · 10

Three-dimensional InP-DHBT on SiGe-BiCMOS integration by means of Benzocyclobutene based wafer bonding for MM-wave circuits

2013 · I. Ostermay, A. Thies, et al. · Microelectronic Engineering · 7

Works count: 40

Citation count: 890

H-index: 17

I10-index: 24