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Chih-Pin Hung
Observed names:
C. P. Hung,
Chen-Chao Wang
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institutions:
National Sun Yat-sen University,
National Tsing Hua University,
Advanced Semiconductor Engineering (Taiwan),
National Cheng Kung University
ORCID:
0000-0001-9023-3999
Observed ORCID:
0000-0001-9023-3999
OpenAlex ID:
A5108190027
TSV technology for 2.5D IC solution
2012
·
Meng-Jen Wang
, Chang-Ying Hung
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
52
Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate
2010
·
Yung-Shou Cheng
, Wei-Da Guo
, et al.
·
IEEE Transactions on Advanced Packaging
·
32
Optimum Design of Transformer-Type Marchand Balun Using Scalable Integrated Passive Device Technology
2011
·
Chien-Hsiang Huang
, Tzyy-Sheng Horng
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
30
Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints
2020
·
Jenn-Ming Song
, Bo-Chang Huang
, et al.
·
Nanomaterials
·
27
PDF
Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs
2001
·
Tzyy-Sheng Horng
, Sung-Mao Wu
, et al.
·
IEEE Transactions on Microwave Theory and Techniques
·
25
A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate
2022
·
Hung-Chun Kuo
, Chih-Wen Kuo
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
23
Characterization of Dual Side Molding SiP Module
2017
·
Jin-Yuan Lai
, Tang-Yuan Chen
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
23
Vertical interconnect measurement techniques based on double-sided probing system and short-open-load-reciprocal calibration
2011
·
Kuan-Chung Lu
, Yi-Chieh Lin
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
22
Implementation of hierarchical dendritic wicks in vapor chambers for high-power heat dissipation applications
2025
·
Chao-Yang Chiang
, Po-Hsun He
, et al.
·
Applied Thermal Engineering
·
21
A packaged 2.4 GHz LNA in a 0.15µm CMOS process with 2kV HBM ESD protection
2002
·
V. Chandrasekhar
, Chih-Pin Hung
, et al.
·
European Solid-State Circuits Conference (ESSCIRC)
·
21
An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging
2025
·
Kuan-Ju Shao
, Meng-Chun Chiu
, et al.
·
Materials Science in Semiconductor Processing
·
20
Enhanced Cu-to-Cu direct bonding by controlling surface physical properties
2017
·
Po-Hao Chiang
, Sin-Yong Liang
, et al.
·
Japanese Journal of Applied Physics
·
20
PDF
Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages
2001
·
Tzyy-Sheng Horng
, Sung-Mao Wu
, et al.
·
IEEE Transactions on Advanced Packaging
·
16
Light enhanced direct Cu bonding for advanced electronic assembly
2018
·
Sin-Yong Liang
, Jenn-Ming Song
, et al.
·
Journal of Materials Science Materials in Electronics
·
15
Effect of flip-chip ball grid array structure on capillary underfill flow
2024
·
Hao-Hsi Hung
, Yu-Chi Cheng
, et al.
·
Results in Engineering
·
14
The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
2016
·
Ying-Ta Chiu
, Tzu-Hsing Chiang
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
14
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond
2009
·
Fu-Yi Han
, Kung-Chung Lu
, et al.
·
IEEE MTT-S International Microwave Symposium digest
·
13
Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules
2015
·
Cheng-Yu Ho
, Hung-Hsiang Cheng
, et al.
·
IEEE Transactions on Microwave Theory and Techniques
·
12
Analysis of flip-chip ball grid array underfill flow process
2024
·
Hao-Hsi Hung
, Yu-Chi Cheng
, et al.
·
The International Journal of Advanced Manufacturing Technology
·
10
Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
2024
·
Yen-Cheng Huang
, Min-Yan Tsai
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Microstructural effects of copper deposits on direct bonding for 3D IC integration
2023
·
Zong-Yu Xie
, Po-Kai Huang
, et al.
·
Journal of Materials Research and Technology
·
8
Low cost QFN package design for millimeter-wave applications
2012
·
Yi-Chieh Lin
, Yu-Chih Lin
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration
2024
·
Chien-Lung Liang
, Yung-Sheng Lin
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
7
Creative Design and Structure Applied to Chiplets Packaging
2023
·
Chen-Chao Wang
, Chih-Yi Huang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
High Thermal Performance Package with Anisotropic Thermal Conductive Material
2017
·
Ian Hu
, Jia-Rung Ho
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
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Works count:
107
Citation count:
610
H-index:
15
I10-index:
20
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