Work

High Thermal Performance Package with Anisotropic Thermal Conductive Material

Year: 2017

Type: conference-paper

Source: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2017.115

Authors: Ian Hu, Jia-Rung Ho, Jin-Feng Yang, Meng-Kai Shih, David Tarng, Chih-Pin Hung

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W2743570969

FWCI: 3.139

Cites: 13

Cited by: 7

Related to: 10